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LPC1343FHN33,551

NXP Semiconductors

LPC1343FHN33,551 by NXP Semiconductors

NXP Semiconductors' LPC1343FHN33,551 is a 32-bit ARM7 microcontroller with 3.3V supply, 8-Ch 10-Bit ADC channels, and 25 MHz clock frequency. Ideal for industrial applications requiring high-speed connectivity via I2C, SPI, UART, USB interfaces. Operating temperature range from -40 to 85°C makes it suitable for various embedded systems.

Median Price

$3.537

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 196 parts In-Stock

1+ parts

$6.030

100+ parts

$3.720

1k+ parts

$3.090

10k+ parts

-

196

$6.030

$3.720

$3.090

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Rochester

USA . 19,119 parts In-Stock

1+ parts

-

100+ parts

$3.100

1k+ parts

$2.770

10k+ parts

$2.610

19,119

-

$3.100

$2.770

$2.610

Verical

USA . 9,880 parts In-Stock

1+ parts

-

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$3.537

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9,880

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$3.537

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Flip Electronics (Authorized)

USA . 260 parts In-Stock

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260

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Distributors (In-Stock)

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Digiode

USA . 397 parts In-Stock

1+ parts

$3.268

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397

$3.268

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Vyrian

USA . 11,017 parts In-Stock

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11,017

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Anansix

USA . 936 parts In-Stock

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936

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Flip Electronics

USA . 260 parts In-Stock

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260

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IBS Electronics

USA . 260 parts In-Stock

1+ parts

-

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$4.222

10k+ parts

$4.151

260

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-

$4.222

$4.151

ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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10

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ComSIT USA

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Corphita

USA . 4,843 parts In-Stock

1+ parts

$3.096

100+ parts

-

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4,843

$3.096

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Continental Prestige Electronics

USA . 3 parts In-Stock

1+ parts

$3.630

100+ parts

$2.380

1k+ parts

$1.690

10k+ parts

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3

$3.630

$2.380

$1.690

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Microchip USA

USA . 2,816 parts In-Stock

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$22.176

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2,816

$22.176

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Lixinc

USA . 7,240 parts In-Stock

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7,240

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UNI Independent Distributors

Spain . 5,034 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,179 parts In-Stock

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2,179

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GreenTree Electronics

Israel . 1,040 parts In-Stock

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1,040

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Perfect Parts

USA . 291 parts In-Stock

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291

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Overview

Unlock the potential of your projects with the LPC1343FHN33,551 microcontroller by NXP Semiconductors. Known for their top-notch quality and reliability, NXP Semiconductors delivers cutting-edge technology in the form of this 32-bit ARM7 CPU family device. With a wide range of applications including connectivity through I2C, SPI, UART, USB, and more, this industrial-grade microcontroller offers 8-channel 10-bit ADC channels and 8192 bytes of RAM. Say goodbye to limitations and hello to endless possibilities with the LPC1343FHN33,551.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Allows for easy and efficient PCB board assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

Provides a wide operating voltage range, allowing flexibility in power supply options.

Package Shape: SQUARE

Square shape helps in efficient PCB layout and space utilization.

Bit Size: 32

32-bit architecture provides higher processing power and performance for demanding applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals and interfaces, simplifying system design and reducing external components.

Maximum Clock Frequency: 25 MHz

Offers high-speed processing capability for applications that require quick response times.

Analog To Digital Convertors: 8-Ch 10-Bit

Integrated ADC channels facilitate analog signal processing, making this microcontroller suitable for sensor interfacing and data acquisition applications.

ROM Programmability: FLASH

Flash programmable memory allows for easy firmware updates and customization of the microcontroller's behavior.

Connectivity: I2C, MICROWIRE, RS485, SPI, SSI, SSP, UART, USB

Support for various communication protocols enables seamless integration with other devices and systems.

Technical Specifications

Microcontrollers LPC1343FHN33,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N33

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, MICROWIRE, RS485, SPI, SSI, SSP, UART, USB

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1343FHN33,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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