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LPC1317FHN33,551

NXP Semiconductors

LPC1317FHN33,551 by NXP Semiconductors

NXP Semiconductors' LPC1317FHN33,551 is a 32-bit microcontroller with 3.3V supply, 25MHz clock frequency, and 8192 bytes of RAM. Ideal for industrial applications, it operates b/w -40 to 85°C and features a FLASH ROM programmability for versatile usage in various electronic systems.

Median Price

$4.916

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 5,270 parts In-Stock

1+ parts

$3.083

100+ parts

-

1k+ parts

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10k+ parts

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5,270

$3.083

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Chip1Stop

Japan . 5,770 parts In-Stock

1+ parts

$6.750

100+ parts

$4.050

1k+ parts

$3.550

10k+ parts

$3.400

5,770

$6.750

$4.050

$3.550

$3.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,274 parts In-Stock

1+ parts

$3.990

100+ parts

-

1k+ parts

-

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3,274

$3.990

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-

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$5.078

100+ parts

-

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300

$5.078

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-

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Vyrian

USA . 5,263 parts In-Stock

1+ parts

-

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5,263

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Anansix

USA . 1,941 parts In-Stock

1+ parts

-

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1,941

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,054 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

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10k+ parts

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6,054

$2.860

-

-

-

Corphita

USA . 1,895 parts In-Stock

1+ parts

$3.780

100+ parts

-

1k+ parts

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10k+ parts

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1,895

$3.780

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Advanced Electronics

New Zealand . 18 parts In-Stock

1+ parts

$19.956

100+ parts

$18.160

1k+ parts

$16.364

10k+ parts

-

18

$19.956

$18.160

$16.364

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Microchip USA

USA . 2,866 parts In-Stock

1+ parts

$26.130

100+ parts

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2,866

$26.130

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iodParts Technologies Inc.

India . 5,980 parts In-Stock

1+ parts

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100+ parts

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5,980

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UNI Independent Distributors

Spain . 4,111 parts In-Stock

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4,111

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Futuretech Components

Singapore . 3,000 parts In-Stock

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100+ parts

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3,000

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Lixinc

USA . 2,986 parts In-Stock

1+ parts

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2,986

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,000

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$4.977

1k+ parts

$4.825

10k+ parts

$4.723

50

-

$4.977

$4.825

$4.723

Overview

Unlock the power of innovation with the LPC1317FHN33,551 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality microcontrollers that push boundaries and drive progress. Ideal for a wide range of applications, this product offers unmatched value, benefits, and advantages to customers looking to elevate their projects to the next level. Stay ahead of the curve with the LPC1317FHN33,551 and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for portable or rugged applications.

Surface Mount: YES

Ease of mounting and soldering on circuit boards, efficient use of space, and potentially lower manufacturing costs.

Maximum Supply Voltage: 3.6 V

Provides flexibility for various power supply options and compatibility with a wide range of systems.

Bit Size: 32

Higher bit size allows for processing larger data sets and performing complex operations, enhancing overall performance.

Power Supplies (V): 3.3

Common power supply voltage which simplifies integration into existing systems and reduces the need for additional components.

No. of Terminals: 33

Sufficient number of terminals for connecting to external devices and components, enabling versatile functionality.

CPU Family: CORTEX-M3

The Cortex-M3 architecture is known for its energy efficiency and high performance, making it suitable for power-sensitive applications.

ADC Channels: YES

Integrated Analog-to-Digital Converters allow for direct interface with analog sensors or signals, expanding the range of possible applications.

RAM Bytes: 8192

A decent amount of memory for storing and processing data, enhancing the microcontroller's capability to run complex algorithms or applications.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller, enabling flexibility in updating firmware or adding new features.

Technical Specifications

Microcontrollers LPC1317FHN33,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N33

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

33

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LPC1317FHN33,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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