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LPC1315FHN33,551

NXP Semiconductors

LPC1315FHN33,551 by NXP Semiconductors

NXP Semiconductors' LPC1315FHN33,551 is a 32-bit microcontroller with 3.3V supply, operating from -40 to 85°C. Featuring 26 I/O lines and 32768 ROM words, it's ideal for industrial applications requiring a max clock frequency of 25MHz.

Median Price

$3.240

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 353 parts In-Stock

1+ parts

$3.510

100+ parts

$3.190

1k+ parts

$3.050

10k+ parts

-

353

$3.510

$3.190

$3.050

-

DigiKey

USA . 251 parts In-Stock

1+ parts

$5.790

100+ parts

$3.710

1k+ parts

-

10k+ parts

-

251

$5.790

$3.710

-

-

Verical

USA . 9,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.260

10k+ parts

-

9,880

-

-

$3.260

-

Arrow

USA . 1,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.758

10k+ parts

-

1,560

-

-

$2.758

-

Chip1Stop

Japan . 1,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.220

10k+ parts

$3.170

1,560

-

-

$3.220

$3.170

Rochester

USA . 44 parts In-Stock

1+ parts

-

100+ parts

$2.850

1k+ parts

$2.550

10k+ parts

$2.400

44

-

$2.850

$2.550

$2.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,618 parts In-Stock

1+ parts

$3.012

100+ parts

-

1k+ parts

-

10k+ parts

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3,618

$3.012

-

-

-

Chip Stock

USA . 130,000 parts In-Stock

1+ parts

-

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130,000

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-

-

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Vyrian

USA . 8,393 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,393

-

-

-

-

Anansix

USA . 2,826 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,826

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 274 parts In-Stock

1+ parts

$2.853

100+ parts

-

1k+ parts

-

10k+ parts

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274

$2.853

-

-

-

Microchip USA

USA . 7,350 parts In-Stock

1+ parts

$20.440

100+ parts

-

1k+ parts

-

10k+ parts

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7,350

$20.440

-

-

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$29.643

100+ parts

$26.975

1k+ parts

$24.307

10k+ parts

-

50

$29.643

$26.975

$24.307

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A-Z Elektronik GmbH

Germany . 6,965 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,965

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UNI Independent Distributors

Spain . 1,553 parts In-Stock

1+ parts

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1,553

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Perfect Parts

USA . 582 parts In-Stock

1+ parts

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100+ parts

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582

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Kepictronics

USA . 490 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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490

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-

-

Overview

Elevate your electronic designs with the LPC1315FHN33,551 microcontroller from NXP Semiconductors. This high-quality product offers unmatched performance and reliability, making it the ideal choice for a wide range of applications. With its advanced features and innovative technology, this microcontroller provides customers with exceptional value and benefits, ensuring seamless integration and optimal functionality. Trust NXP Semiconductors to deliver cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Ease of installation and space-saving design.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power input options.

Bit Size: 32

High processing capability for complex tasks.

CPU Family: CORTEX-M3

A powerful and energy-efficient processor for improved performance.

ROM Words: 32768

Sufficient memory capacity for storing program instructions.

RAM Bytes: 8192

Adequate memory for data storage and manipulation.

Maximum Clock Frequency: 25 MHz

Fast processing speed for quick response times.

Temperature Grade: INDUSTRIAL

Can withstand harsh environmental conditions in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient and reliable peripheral integration for enhanced functionality.

Technical Specifications

Microcontrollers LPC1315FHN33,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N33

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

33

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LPC1315FHN33,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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