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LPC11U37HFBD64/4QL

NXP Semiconductors

LPC11U37HFBD64/4QL by NXP Semiconductors

NXP Semiconductors' LPC11U37HFBD64/4QL is a 32-bit microcontroller with 64 terminals, operating at a max clock frequency of 25 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed data processing and control functions. With a low profile flatpack package style, it is ideal for compact electronic devices needing efficient performance within limited space constraints.

Median Price

$4.616

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 248 parts In-Stock

1+ parts

$4.080

100+ parts

$3.840

1k+ parts

$3.470

10k+ parts

-

248

$4.080

$3.840

$3.470

-

Mouser Electronics

USA . 73 parts In-Stock

1+ parts

$8.730

100+ parts

$4.610

1k+ parts

$4.330

10k+ parts

$4.250

73

$8.730

$4.610

$4.330

$4.250

Verical

USA . 9,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.616

10k+ parts

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9,920

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-

$4.616

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Flip Electronics (Authorized)

USA . 4,960 parts In-Stock

1+ parts

-

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4,960

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Distributors (In-Stock)

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Digiode

USA . 4,872 parts In-Stock

1+ parts

$3.876

100+ parts

-

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4,872

$3.876

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-

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Nova Conductors

Japan . 23 parts In-Stock

1+ parts

$4.788

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-

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23

$4.788

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DF Sales Co.

USA . 4 parts In-Stock

1+ parts

$5.000

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-

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4

$5.000

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DF Sales Co.

USA . 4 parts In-Stock

1+ parts

$5.000

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-

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4

$5.000

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Flip Electronics

USA . 17,120 parts In-Stock

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17,120

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Vyrian

USA . 7,591 parts In-Stock

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7,591

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Anansix

USA . 2,233 parts In-Stock

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2,233

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DigiKey Marketplace

USA . 750 parts In-Stock

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750

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Distributors (Availability)

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Semicontronic

India . 1,557 parts In-Stock

1+ parts

$3.470

100+ parts

$3.383

1k+ parts

$3.366

10k+ parts

-

1,557

$3.470

$3.383

$3.366

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Ampacity Inc.

Singapore . 1,544 parts In-Stock

1+ parts

$3.470

100+ parts

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1,544

$3.470

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Corphita

USA . 1,044 parts In-Stock

1+ parts

$3.672

100+ parts

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1,044

$3.672

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Corohmni

South Africa . 1,075 parts In-Stock

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$5.600

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1,075

$5.600

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Vigor

Singapore . 1,932 parts In-Stock

1+ parts

$7.400

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1,932

$7.400

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Microchip USA

USA . 1,876 parts In-Stock

1+ parts

$23.632

100+ parts

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1,876

$23.632

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Andel Nordic

Denmark . 276 parts In-Stock

1+ parts

$30.510

100+ parts

-

1k+ parts

$21.357

10k+ parts

$21.357

276

$30.510

-

$21.357

$21.357

UNI Independent Distributors

Spain . 3,690 parts In-Stock

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3,690

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Argo Parts USA

USA . 3,407 parts In-Stock

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3,407

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Continental Prestige Electronics

USA . 3,305 parts In-Stock

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3,305

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 532 parts In-Stock

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532

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iodParts Technologies Inc.

India . 60 parts In-Stock

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60

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Computer Components Inc. - USA

USA . 60 parts In-Stock

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60

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Overview

Unlock the power of innovation with the LPC11U37HFBD64/4QL microcontroller by NXP Semiconductors. Designed with precision and reliability, this cutting-edge device offers endless possibilities in various applications. From smart home automation to industrial control systems, this microcontroller provides seamless integration, high performance, and efficiency. Experience the value and benefits of advanced technology with the LPC11U37HFBD64/4QL, setting a new standard for excellence in microcontrollers.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact PCB assembly, saving space and making the product suitable for small form factor applications.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different power requirements in various applications.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB real estate and simplifies the design layout.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities, suitable for handling complex algorithms and computations.

No. of Terminals: 64

Having a higher number of terminals provides connectivity options for a wide range of external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers durability, low profile design, and fine pitch for higher integration density on the PCB.

Minimum Supply Voltage: 1.8 V

Supports low supply voltages for power efficiency and battery-operated applications.

Terminal Finish: TIN

Tin terminal finish provides good solderability and conductivity for reliable connections during PCB assembly.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing, enabling sensor interfacing and data acquisition capabilities.

DMA Channels: YES

DMA channels improve data transfer efficiency by offloading data movement tasks from the CPU, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position adds mechanical stability to the package and facilitates easier soldering during assembly.

Width: 10 mm

Compact width dimension allows for space-saving PCB design and compatibility with constrained board layouts.

Maximum Clock Frequency: 25 MHz

High clock frequency capability provides fast processing speed for real-time applications and responsive system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Supports quick reflow soldering process with a short time duration, reducing assembly time and enhancing production efficiency.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robust solder joints and reliability during the PCB assembly process.

Length: 10 mm

Compact length dimension complements the width dimension for a space-efficient overall footprint on the PCB.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in microcontroller peripheral IC type offers efficient instruction execution and processing speed for optimized performance.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and secure solder joints for reliable electrical connections on the PCB.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent operation and performance of the microcontroller in various operating conditions.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB, enabling compact system designs and efficient use of available space.

Speed: 50 rpm

Operational speed of 50 rpm provides adequate processing power for a wide range of applications, from simple control tasks to more complex computations.

No. of I/O Lines: 54

Having a high number of I/O lines offers flexibility for interfacing with external devices and peripherals, expanding the overall functionality of the product.

Technical Specifications

Microcontrollers LPC11U37HFBD64/4QL attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

54

No. of Terminals:

64

PWM Channels:

NO

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LPC11U37HFBD64/4QL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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