Loading...

LPC11U37FBD64/401,

NXP Semiconductors

LPC11U37FBD64/401, by NXP Semiconductors

The LPC11U37FBD64/401 from NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 54 I/O lines, and an industrial temperature range (-40 °C to 85 °C). It supports USB connectivity and includes ADC channels for versatile applications. Ideal for embedded systems requiring efficient performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,442 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,442

-

-

-

-

Anansix

USA . 2,526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,526

-

-

-

-

Digiode

USA . 236 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

236

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,180 parts In-Stock

1+ parts

$4.059

100+ parts

-

1k+ parts

-

10k+ parts

-

2,180

$4.059

-

-

-

One Stop Electronics

USA . 489 parts In-Stock

1+ parts

$9.000

100+ parts

-

1k+ parts

-

10k+ parts

-

489

$9.000

-

-

-

AZTECH Wire

Italy . 152 parts In-Stock

1+ parts

$10.540

100+ parts

-

1k+ parts

-

10k+ parts

-

152

$10.540

-

-

-

Corphita

USA . 3,056 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,056

-

-

-

-

UNI Independent Distributors

Spain . 806 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

806

-

-

-

-

Overview

Unlock your design potential with the LPC11U37FBD64/401 microcontroller from NXP Semiconductors, a trusted leader in innovative technology. This versatile 32-bit Cortex-M0 unit delivers exceptional performance in compact, energy-efficient applications, making it perfect for embedded systems, industrial automation, and consumer electronics. Experience seamless connectivity and rich peripheral support, ensuring your projects thrive while benefiting from NXP's renowned quality and reliability. Elevate your next project today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure longevity and reliability in diverse applications.

Surface Mount: YES

Allows for compact designs, ideal for modern electronic devices with limited space.

Maximum Supply Voltage: 3.6 V

Supports a common voltage range, making it versatile for various power supply designs.

Package Shape: SQUARE

Facilitates efficient space utilization on PCBs, making it suitable for space-constrained applications.

Bit Size: 32

Enables advanced processing capabilities, allowing for more complex applications and enhanced performance.

Power Supplies (V): 3.3

Standard voltage aligns with many modern systems, promoting compatibility and integration ease.

No. of Terminals: 64

Offers a significant number of connections for flexibility in interfacing with various peripherals.

Package Style (Meter): FLATPACK

Provides a low-profile option for installation, advantageous for designs with height restrictions.

Minimum Supply Voltage: 1.8 V

Enables operation in low-power applications, enhancing energy efficiency for battery-operated devices.

Maximum Operating Temperature: 85 °C

Suitable for industrial and automotive applications where higher temperature tolerances are necessary.

CPU Family: CORTEX-M0

Delivers a balance of performance and power efficiency, ideal for low-power embedded applications.

Minimum Operating Temperature: -40 °C

Essential for operation in harsh environments, ensuring reliability in extreme conditions.

ADC Channels: YES

Enables analog signal processing, crucial for applications that require converting real-world signals.

Terminal Position: QUAD

Optimizes layout for routing on PCBs, improving signal integrity and reducing noise.

ROM Words: 131072

Provides ample program storage, allowing for complex applications without constraints.

Width: 10 mm

Compact size makes it suitable for tight spaces in compact electronic devices.

Data EEPROM Size: 4096

Allows for data retention even during power loss, crucial for applications needing persistent data storage.

Peripherals: POR, PWM(6), TIMER(5), WDT

Rich set of peripherals enhances functionality for a variety of applications.

Maximum Clock Frequency: 25 MHz

Provides sufficient processing speed for most embedded applications, enabling efficient operation.

Length: 10 mm

Compact dimensions facilitate integration into small-scale designs, ideal for portable electronics.

Temperature Grade: INDUSTRIAL

Ensures reliability and performance in demanding industrial environments.

RAM Bytes: 12288

Generous RAM size supports complex processing tasks and efficient execution of applications.

Technology: CMOS

Low power consumption technology, enhancing efficiency and prolonging battery life in portable devices.

Terminal Form: GULL WING

Standardized form for easy compatibility with existing PCB designs and manufacturing processes.

Analog To Digital Convertors: 8-Ch 10-Bit

Supports multiple channels of data acquisition, allowing for versatile applications in sensor interfacing.

Nominal Supply Voltage: 3.3 V

Ensures stable operation across a wide range of applications, promoting system reliability.

PWM Channels: YES

Facilitates motor control and other applications requiring precise signal modulation.

Connectivity: I2C, SSP(2), UART, USB

Diverse connectivity options enhance interoperability with a variety of devices and systems.

ROM Programmability: FLASH

Allows for easy updates and modifications to firmware, ensuring the product remains relevant over time.

Terminal Pitch: 0.5 mm

Fine pitch allows for high-density designs, accommodating more features in limited PCB space.

Speed: 50 rpm

Suits applications requiring controlled motoring, enhancing functionality in robotics and automation.

On Chip Program ROM Width: 8

Optimized for efficient data management and execution, enhancing overall performance.

No. of I/O Lines: 54

Provides extensive interfacing options for various peripherals, maximizing versatility in designs.

Technical Specifications

Microcontrollers LPC11U37FBD64/401, attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

54

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Data EEPROM Size:

4096

Connectivity:

I2C, SSP(2), UART, USB

Peripherals:

POR, PWM(6), TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC11U37FBD64/401, Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20