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LPC11U34FBD48/311

NXP Semiconductors

LPC11U34FBD48/311 by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

Median Price

$5.720

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 116 parts In-Stock

1+ parts

$5.720

100+ parts

$3.660

1k+ parts

$3.290

10k+ parts

$3.197

116

$5.720

$3.660

$3.290

$3.197

Mouser Electronics

USA . 522 parts In-Stock

1+ parts

$7.360

100+ parts

$4.430

1k+ parts

$3.330

10k+ parts

-

522

$7.360

$4.430

$3.330

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Rochester

USA . 566 parts In-Stock

1+ parts

-

100+ parts

$2.810

1k+ parts

$2.520

10k+ parts

$2.370

566

-

$2.810

$2.520

$2.370

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,661 parts In-Stock

1+ parts

$2.698

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$2.698

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Flip Electronics

USA . 12,500 parts In-Stock

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12,500

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Vyrian

USA . 3,717 parts In-Stock

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DigiKey Marketplace

USA . 566 parts In-Stock

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566

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Anansix

USA . 174 parts In-Stock

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174

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Distributors (Availability)

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Ampacity Inc.

Singapore . 231 parts In-Stock

1+ parts

$2.410

100+ parts

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231

$2.410

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Corphita

USA . 3,267 parts In-Stock

1+ parts

$2.556

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3,267

$2.556

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Vigor

Singapore . 100 parts In-Stock

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$5.150

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100

$5.150

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Microchip USA

USA . 4,995 parts In-Stock

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$18.340

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$18.340

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,402 parts In-Stock

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6,402

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Kepictronics

USA . 4,769 parts In-Stock

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4,769

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UNI Independent Distributors

Spain . 4,408 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,268 parts In-Stock

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4,268

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Perfect Parts

USA . 168 parts In-Stock

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168

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Technical Specifications

Microcontrollers LPC11U34FBD48/311 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

40

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

40960

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LPC11U34FBD48/311 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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