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LPC11U23FBD48/301

NXP Semiconductors

LPC11U23FBD48/301 by NXP Semiconductors

LPC11U23FBD48/301 from NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 8-channel ADC, and operates in -40 °C to 85 °C range. Ideal for industrial applications, it supports I2C and USB connectivity with low-profile packaging. Its compact design includes 6144 bytes RAM and 24576 words ROM for efficient processing.

Median Price

$2.880

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 550 parts In-Stock

1+ parts

$2.300

100+ parts

$2.220

1k+ parts

$2.140

10k+ parts

-

550

$2.300

$2.220

$2.140

-

Rochester

USA . 62 parts In-Stock

1+ parts

$2.880

100+ parts

$2.710

1k+ parts

$2.450

10k+ parts

-

62

$2.880

$2.710

$2.450

-

Flip Electronics (Authorized)

USA . 828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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828

-

-

-

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Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.926

10k+ parts

-

250

-

-

$2.926

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,396 parts In-Stock

1+ parts

$2.574

100+ parts

-

1k+ parts

-

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4,396

$2.574

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-

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Vyrian

USA . 5,518 parts In-Stock

1+ parts

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1k+ parts

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5,518

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Anansix

USA . 1,088 parts In-Stock

1+ parts

-

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1,088

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-

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IBS Electronics

USA . 550 parts In-Stock

1+ parts

-

100+ parts

$3.042

1k+ parts

$2.925

10k+ parts

-

550

-

$3.042

$2.925

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NAC Semi

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.380

10k+ parts

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500

-

-

$3.380

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Flip Electronics

USA . 284 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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284

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,397 parts In-Stock

1+ parts

$2.439

100+ parts

-

1k+ parts

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10k+ parts

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4,397

$2.439

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Microchip USA

USA . 5,441 parts In-Stock

1+ parts

$16.100

100+ parts

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5,441

$16.100

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UNI Independent Distributors

Spain . 6,943 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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6,943

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Overview

Unlock endless possibilities for your next project with the LPC11U23FBD48/301 microcontroller from NXP Semiconductors! Designed for reliability and performance, this compact powerhouse offers exceptional energy efficiency and robust connectivity options. Perfect for industrial automation, IoT devices, and consumer electronics, it ensures seamless integration and superior functionality. Experience unmatched quality and innovation that empowers your designs to thrive in today’s competitive landscape!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface Mount technology allows for compact designs and ease of integration into modern printed circuit boards (PCBs), enhancing space efficiency.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V provides flexibility in power supply design while ensuring compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shape aids in optimal space utilization on the PCB and simplifies layout design.

Bit Size: 32

A 32-bit architecture allows for advanced processing capabilities and better handling of complex operations compared to lower bit sizes.

Power Supplies (V): 3.3

Optimized for 3.3V supply, this microcontroller integrates well with most modern electronics, ensuring efficient power management.

No. of Terminals: 48

With 48 terminals, this microcontroller enables multiple I/O operations, providing extensive interfacing opportunities for peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile design promotes a sleek profile that contributes to space-saving on PCBs, ideal for compact electronic products.

Minimum Supply Voltage: 1.8 V

The ability to operate with a minimum supply voltage of 1.8 V enhances power efficiency, allowing for applications in battery-powered devices.

Maximum Operating Temperature: 85 °C

With an operational temperature of up to 85 °C, this microcontroller is suitable for industrial applications where higher temperatures can occur.

CPU Family: CORTEX-M0

The Cortex-M0 CPU family is known for low power consumption and efficient processing, perfect for energy-sensitive applications.

Minimum Operating Temperature: -40 °C

Supporting a minimum operating temperature of -40 °C ensures reliability in extreme environments, making it a versatile choice for challenging conditions.

ADC Channels: YES

Integrated ADC channels enhance measurement capabilities for sensor data acquisition, boosting the microcontroller's application range.

Terminal Position: QUAD

The quad terminal positioning allows for easier layout design and minimizes interference from adjacent connections.

ROM Words: 24576

With 24576 ROM words, this microcontroller offers ample memory for storing program instructions, allowing complex functionality.

Maximum Seated Height: 1.6 mm

A low seated height of 1.6 mm aids in design flexibility and integration into tighter spaces without compromising performance.

Width: 7 mm

At just 7 mm in width, the microcontroller is compact, making it suitable for space-constrained applications.

Data EEPROM Size: 1024

With 1024 bytes of data EEPROM, this microcontroller can store non-volatile data effectively, beneficial for user settings and configurations.

Peripherals: BOD, COMPARATOR, POR, TIMER(5), WDT

A rich set of built-in peripherals enhances functionality, offering developers multiple tools for effective application development.

Maximum Clock Frequency: 25 MHz

Operating at a maximum clock frequency of 25 MHz provides a good balance of performance and power consumption for various tasks.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates suitability for modern soldering techniques, ensuring compatibility with mass production.

Length: 7 mm

The length of 7 mm aligns with its width for a compact form factor, ideal for miniaturized electronics.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the microcontroller performs reliably in a range of demanding environments, enhancing its application scope.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers high performance with relatively low power consumption, suitable for efficient computing needs.

RAM Bytes: 6144

With 6144 bytes of RAM, this microcontroller supports complex data management and real-time processing, improving overall performance.

Technology: CMOS

Using CMOS technology translates to lower power consumption and high noise immunity, suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and handling, improving manufacturability and assembly processes.

Analog To Digital Convertors: 8-Ch 10-Bit

Having 8 channels of 10-bit ADCs enables versatile signal processing capabilities for various applications, particularly in sensing.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V optimizes the power consumption profile, essential for portable electronic devices.

Connectivity: I2C, SSP(2), USB

Rich connectivity options like I2C, SSP, and USB enable seamless integration with other components and systems, enhancing functionality.

ROM Programmability: FLASH

The FLASH ROM programmability allows for easy updates and modifications of the firmware, providing flexibility throughout the product's lifespan.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density PCB designs, ideal for modern compact electronics.

Speed: 50 rpm

The specification for speed (50 rpm) could indicate compatibility with various actuators/motors, enhancing the applicability in motion control applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports a variety of applications while maintaining efficient data handling and processing capabilities.

No. of I/O Lines: 40

With 40 I/O lines, this microcontroller facilitates extensive interfacing with peripherals, making it highly versatile for different projects.

Technical Specifications

Microcontrollers LPC11U23FBD48/301 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

40

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1024

Connectivity:

I2C, SSP(2), USB

Peripherals:

BOD, COMPARATOR, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC11U23FBD48/301 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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