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LPC11U14FHN33/201

NXP Semiconductors

LPC11U14FHN33/201 by NXP Semiconductors

LPC11U14FHN33/201 from NXP is a 32-bit microcontroller with a max supply voltage of 3.6V and operates b/w -40 °C to 85 °C. It features 8 ADC channels, 6144 bytes of RAM, and supports various connectivity options like USB and I2C. Ideal for industrial applications requiring compact design and reliability.

Median Price

$4.710

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 46 parts In-Stock

1+ parts

$4.570

100+ parts

$2.883

1k+ parts

$2.647

10k+ parts

$2.501

46

$4.570

$2.883

$2.647

$2.501

Chip1Stop

Japan . 210 parts In-Stock

1+ parts

$4.849

100+ parts

$2.701

1k+ parts

-

10k+ parts

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210

$4.849

$2.701

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Mouser Electronics

USA . 260 parts In-Stock

1+ parts

$6.130

100+ parts

$3.450

1k+ parts

$2.930

10k+ parts

$2.620

260

$6.130

$3.450

$2.930

$2.620

Verical

USA . 9,880 parts In-Stock

1+ parts

-

100+ parts

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$2.277

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9,880

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-

$2.277

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Flip Electronics (Authorized)

USA . 520 parts In-Stock

1+ parts

-

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520

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 168 parts In-Stock

1+ parts

$4.607

100+ parts

-

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168

$4.607

-

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-

Chip Stock

USA . 16,221 parts In-Stock

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16,221

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Vyrian

USA . 4,774 parts In-Stock

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4,774

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Anansix

USA . 2,309 parts In-Stock

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2,309

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Flip Electronics

USA . 520 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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520

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,534 parts In-Stock

1+ parts

$1.700

100+ parts

-

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3,534

$1.700

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Continental Prestige Electronics

USA . 1 parts In-Stock

1+ parts

$2.450

100+ parts

-

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1

$2.450

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Corphita

USA . 94 parts In-Stock

1+ parts

$4.364

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94

$4.364

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Microchip USA

USA . 6,617 parts In-Stock

1+ parts

$17.172

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6,617

$17.172

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Kepictronics

USA . 30,160 parts In-Stock

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30,160

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A-Z Elektronik GmbH

Germany . 5,922 parts In-Stock

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5,922

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UNI Independent Distributors

Spain . 5,720 parts In-Stock

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5,720

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Alle Elektronik GmbH

Germany . 3,948 parts In-Stock

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3,948

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Unlock the power of innovation with the LPC11U14FHN33/201 microcontroller by NXP Semiconductors, a leader in quality and reliability. Designed for diverse applications like IoT devices and industrial automation, this compact chip offers exceptional performance and low power consumption. Enjoy seamless connectivity options and robust features that empower you to create efficient solutions. Elevate your projects with NXP's trusted technology—where excellence meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, ensuring reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, making it suitable for modern electronic projects.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage is low, which contributes to lower power consumption—a critical factor in battery-operated devices.

Package Shape: SQUARE

The square package shape facilitates efficient use of space on circuit boards, allowing for easier integration into designs.

Bit Size: 32

A 32-bit architecture provides enhanced processing capability, enabling more complex applications and smoother performance.

No. of Terminals: 33

With 33 terminals, it offers a versatile connection interface for multiple peripherals and components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This style supports efficient heat dissipation and compact integration in tight spaces, ideal for sophisticated electronics.

Minimum Supply Voltage: 1.8 V

A minimum supply voltage of 1.8 V enables operation in low-power environments, making it energy-efficient.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C allows this microcontroller to function in a variety of environments, particularly in industrial applications.

Minimum Operating Temperature: -40 °C

The capability to operate down to -40 °C makes it suitable for extreme temperature environments, enhancing its versatility.

ADC Channels: YES

The inclusion of ADC channels makes it perfect for applications requiring precision in analog signal processing.

Terminal Position: QUAD

Quad terminal arrangement facilitates efficient routing and soldering, improving manufacturing processes.

ROM Words: 32768

With 32,768 ROM words, it provides substantial program memory for complex applications and more extensive firmware.

Maximum Seated Height: 1 mm

A very low seated height ensures that the microcontroller can fit into low-profile designs, ideal for compact devices.

Width: 7 mm

A 7 mm width contributes to the compact form factor, making it suitable for space-constrained designs.

Peripherals: BOD, PMU, POR, TIMER(4), WDT

A rich set of peripherals increases functionality, allowing for various control and monitoring applications.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz enables responsive performance for most applications, ensuring proper multitasking capabilities.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C indicates compatibility with standard PCB soldering processes, increasing manufacturability.

Length: 7 mm

At 7 mm in length, this microcontroller fits seamlessly into compact systems without compromising performance.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance in harsh working environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller translates into efficient processing and lower power consumption, enhancing performance.

RAM Bytes: 6144

With 6144 bytes of RAM, it provides sufficient memory for handling tasks and data in real-time applications.

Technology: CMOS

CMOS technology contributes to low power consumption and high noise immunity, making it well-suited for various applications.

Terminal Form: NO LEAD

A no-lead terminal form reduces the footprint on the PCB, allowing for more compact design options.

Analog To Digital Convertors: 8-Ch 10-Bit

With 8 channels and 10-bit resolution, it is perfect for detailed analog-to-digital conversions in a variety of applications.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V fits well with industry standards for low voltage components, enhancing compatibility.

Connectivity: I2C, RS-485, SSP(2), USART, USB

Diverse connectivity options allow integration with numerous devices and systems, making it highly versatile for various applications.

ROM Programmability: FLASH

Flash programmability provides easy updating and modification of the firmware, facilitating product development and debugging.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm supports high-density PCB layouts, making it suitable for advanced electronics manufacturing.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates standard moisture sensitivity, which is adequately manageable during manufacturing and storage.

Speed: 50 rpm

Operational speed of 50 rpm facilitates efficient processing in applications involving motors or moving components.

On Chip Program ROM Width: 8

An 8-bit program ROM width enhances the microcontroller's ability to handle simpler programs efficiently.

No. of I/O Lines: 26

Having 26 I/O lines allows for robust interfacing with numerous external devices, adding to versatility in applications.

Technical Specifications

Microcontrollers LPC11U14FHN33/201 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N33

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, RS-485, SSP(2), USART, USB

Peripherals:

BOD, PMU, POR, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC11U14FHN33/201 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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