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LPC11U12FHN33/201

NXP Semiconductors

LPC11U12FHN33/201 by NXP Semiconductors

LPC11U12FHN33/201 from NXP is a 32-bit microcontroller with a max supply voltage of 3.6V and operates in -40 °C to 85 °C range. It features 8 ADC channels and supports various connectivity options like USB and I2C, ideal for industrial applications. With 6144 bytes RAM and flash ROM, it ensures efficient performance in compact designs.

Median Price

$2.335

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 2 parts In-Stock

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$2.860

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$2.860

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Rochester

USA . 556 parts In-Stock

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$1.810

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$1.620

10k+ parts

$1.530

556

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$1.810

$1.620

$1.530

Distributors (In-Stock)

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Digiode

USA . 2,206 parts In-Stock

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$1.910

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$1.910

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Flip Electronics

USA . 8,735 parts In-Stock

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Vyrian

USA . 2,062 parts In-Stock

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Anansix

USA . 606 parts In-Stock

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606

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Distributors (Availability)

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Corphita

USA . 323 parts In-Stock

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$1.809

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323

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Microchip USA

USA . 2,368 parts In-Stock

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$17.940

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UNI Independent Distributors

Spain . 6,142 parts In-Stock

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Futuretech Components

Singapore . 1,820 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Elevate your designs with the LPC11U12FHN33/201 microcontroller from NXP Semiconductors. Renowned for its exceptional quality and reliability, this compact powerhouse offers versatility across various applications, from industrial automation to consumer electronics. With robust connectivity options and efficient power consumption, it empowers engineers to create innovative solutions while ensuring long-term performance. Choose NXP for cutting-edge technology that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures long-lasting performance and reliability.

Surface Mount: YES

Allows for efficient space usage on PCBs and is compatible with automated assembly processes.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, ensuring compatibility with various power systems.

Package Shape: SQUARE

Compact form factor helps optimize space-sensitive designs.

Bit Size: 32

32-bit architecture enables efficient processing for complex applications.

No. of Terminals: 33

Provides ample connectivity options for various peripherals and external interfaces.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink integration improve heat dissipation, enhancing performance.

Minimum Supply Voltage: 1.8 V

Lower power consumption at a minimum voltage level makes it ideal for battery-powered devices.

Maximum Operating Temperature: 85 °C

Designed for reliable operation in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide operational temperature range makes this microcontroller suitable for extreme conditions.

ADC Channels: YES

Integrated ADC channels allow for direct sensor interfacing, enhancing data acquisition capabilities.

Terminal Position: QUAD

Supports innovative PCB designs with versatile terminal positioning for complex layouts.

ROM Words: 16384

Ample ROM capacity enables complex program storage and execution.

Maximum Seated Height: 1 mm

Low profile design is advantageous for space-restricted applications.

Width: 7 mm

Compact width allows for easy integration into small devices.

Peripherals: BOD, PMU, POR, TIMER(4), WDT

Diverse peripherals support a range of functionalities essential for sophisticated applications.

Maximum Clock Frequency: 25 MHz

Higher clock frequency enhances processing speed, ensuring efficiency in task execution.

Peak Reflow Temperature °C: 260

Designed to withstand high peak temperatures during assembly, ensuring reliability in manufacturing.

Length: 7 mm

Compact length, making it ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments where durability and reliability are paramount.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instruction execution and improved performance.

RAM Bytes: 6144

Sufficient RAM size supports advanced computations and data processing tasks.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation.

Terminal Form: NO LEAD

NO LEAD design enhances mechanical stability during soldering and reduces lead-related issues.

Analog To Digital Converters: 8-Ch 10-Bit

Provides versatile analog to digital conversion for precise signal handling.

Nominal Supply Voltage: 3.3 V

Standard voltage requirement that balances performance with power efficiency.

Connectivity: I2C, RS-485, SSP(2), USART, USB

Multiple connectivity options facilitate easy integration with a variety of devices and systems.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming and updates, enhancing flexibility in application development.

Terminal Pitch: 0.65 mm

Fine terminal pitch supports compact board designs while maintaining reliable connections.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity enables practical handling and storage during assembly processes.

Speed: 50 rpm

Sufficient processing speed for a wide range of control applications.

On Chip Program ROM Width: 8

Efficient 8-bit ROM width enhances compatibility with various programming environments.

No. of I/O Lines: 26

Provides abundant I/O lines for versatility in connecting various peripherals and devices.

Technical Specifications

Microcontrollers LPC11U12FHN33/201 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N33

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

6144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, RS-485, SSP(2), USART, USB

Peripherals:

BOD, PMU, POR, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC11U12FHN33/201 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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