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LPC11E67JBD64E

NXP Semiconductors

LPC11E67JBD64E by NXP Semiconductors

NXP Semiconductors' LPC11E67JBD64E is a 32-bit microcontroller with 3.3V supply, 25MHz clock frequency, and 131072 ROM words. Ideal for industrial applications, it features 12-Ch 12-Bit ADCs, 6 PWM channels, and connectivity options like I2C(2) and USART(4).

Median Price

$6.920

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 380 parts In-Stock

1+ parts

$6.910

100+ parts

$4.580

1k+ parts

$4.020

10k+ parts

$3.490

380

$6.910

$4.580

$4.020

$3.490

DigiKey

USA . 86 parts In-Stock

1+ parts

$6.930

100+ parts

$4.930

1k+ parts

$4.116

10k+ parts

$4.036

86

$6.930

$4.930

$4.116

$4.036

Mouser Electronics

USA . 239 parts In-Stock

1+ parts

$7.540

100+ parts

$4.600

1k+ parts

$4.180

10k+ parts

$4.110

239

$7.540

$4.600

$4.180

$4.110

EBV Elektronik

Germany . 640 parts In-Stock

1+ parts

-

100+ parts

-

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-

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640

-

-

-

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Verical

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$6.110

1k+ parts

-

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50

-

$6.110

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,313 parts In-Stock

1+ parts

$5.292

100+ parts

-

1k+ parts

-

10k+ parts

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3,313

$5.292

-

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Vyrian

USA . 6,386 parts In-Stock

1+ parts

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6,386

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Flip Electronics

USA . 2,880 parts In-Stock

1+ parts

-

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2,880

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-

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Anansix

USA . 1,165 parts In-Stock

1+ parts

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1,165

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 51 parts In-Stock

1+ parts

$4.100

100+ parts

$2.720

1k+ parts

$1.850

10k+ parts

-

51

$4.100

$2.720

$1.850

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Corphita

USA . 4,807 parts In-Stock

1+ parts

$5.013

100+ parts

-

1k+ parts

-

10k+ parts

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4,807

$5.013

-

-

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Component Stockers USA

USA . 455 parts In-Stock

1+ parts

$6.830

100+ parts

$4.390

1k+ parts

$3.990

10k+ parts

-

455

$6.830

$4.390

$3.990

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Microchip USA

USA . 2,587 parts In-Stock

1+ parts

$20.384

100+ parts

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1k+ parts

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10k+ parts

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2,587

$20.384

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Lixinc

USA . 16,755 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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16,755

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UNI Independent Distributors

Spain . 6,842 parts In-Stock

1+ parts

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100+ parts

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6,842

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Overview

Unlock limitless possibilities with the LPC11E67JBD64E by NXP Semiconductors, a top-tier microcontroller designed to elevate your projects to new heights. With its cutting-edge technology and robust features, this device guarantees unrivaled performance and reliability. Ideal for a wide range of applications, from IoT devices to industrial automation, this product offers seamless connectivity and efficient power management. Experience the ultimate in innovation with the LPC11E67JBD64E and revolutionize the way you create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 3.6 V

Allows for higher voltage input which can be useful in various applications requiring a wider voltage range.

Bit Size: 32

Offers a high bit size for processing data, enabling more complex computations and tasks to be handled efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses a RISC architecture for enhanced performance and efficiency in processing instructions, making it a solid choice for computing tasks.

Maximum Clock Frequency: 25 MHz

With a high clock frequency, this microcontroller can quickly execute instructions and tasks, suitable for applications requiring fast processing speeds.

Technical Specifications

Microcontrollers LPC11E67JBD64E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

50

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

I2C(2), SSP(2), USART(4)

Peripherals:

BOD, COMPARATOR, DMA(16), PWM(6), RTC, TIMER(7), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

LPC11E67JBD64E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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