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LPC11E67JBD100E

NXP Semiconductors

LPC11E67JBD100E by NXP Semiconductors

NXP Semiconductors' LPC11E67JBD100E is a 32-bit microcontroller with 131072 ROM words, 20480 RAM bytes, and 8-Ch 12-Bit ADC channels. Ideal for industrial applications, it features a max clock frequency of 25 MHz, connectivity options like I2C and USART, and peripherals such as PWM and RTC.

Median Price

$4.732

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 141 parts In-Stock

1+ parts

$9.840

100+ parts

$6.100

1k+ parts

$5.310

10k+ parts

$5.160

141

$9.840

$6.100

$5.310

$5.160

Verical

USA . 9,990 parts In-Stock

1+ parts

-

100+ parts

$4.413

1k+ parts

-

10k+ parts

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9,990

-

$4.413

-

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EBV Elektronik

Germany . 1,800 parts In-Stock

1+ parts

-

100+ parts

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1,800

-

-

-

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Flip Electronics (Authorized)

USA . 262 parts In-Stock

1+ parts

-

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-

1k+ parts

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262

-

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-

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Future Electronics

Canada . 180 parts In-Stock

1+ parts

-

100+ parts

$5.050

1k+ parts

$4.850

10k+ parts

$4.690

180

-

$5.050

$4.850

$4.690

Rochester

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$4.260

1k+ parts

$3.810

10k+ parts

$3.580

4

-

$4.260

$3.810

$3.580

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,853 parts In-Stock

1+ parts

$4.076

100+ parts

-

1k+ parts

-

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1,853

$4.076

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-

-

Vyrian

USA . 8,642 parts In-Stock

1+ parts

-

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8,642

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Anansix

USA . 1,150 parts In-Stock

1+ parts

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1,150

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Flip Electronics

USA . 262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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262

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,398 parts In-Stock

1+ parts

$3.861

100+ parts

-

1k+ parts

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10k+ parts

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2,398

$3.861

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Microchip USA

USA . 1,634 parts In-Stock

1+ parts

$16.166

100+ parts

-

1k+ parts

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10k+ parts

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1,634

$16.166

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Lixinc

USA . 17,852 parts In-Stock

1+ parts

-

100+ parts

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17,852

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UNI Independent Distributors

Spain . 7,968 parts In-Stock

1+ parts

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100+ parts

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7,968

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Overview

Discover the LPC11E67JBD100E by NXP Semiconductors, a top-tier microcontroller that offers unparalleled quality and reliability. With an array of applications in various industries, this product stands out for its advanced features and superior performance. From its efficient power management to its cutting-edge technology, this microcontroller is designed to meet all your needs. Experience seamless connectivity, enhanced peripherals, and exceptional functionality with the LPC11E67JBD100E. Trust NXP Semiconductors for innovative solutions that drive success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the microcontroller, ensuring durability and longevity.

Maximum Supply Voltage: 3.6 V

Offers a high supply voltage range, allowing for flexibility in power supply options.

No. of Terminals: 100

Provides ample terminal connections for various peripherals and interfaces, enhancing the microcontroller's functionality.

Maximum Operating Temperature: 105 °C

Can operate efficiently in high-temperature environments, making it suitable for industrial applications.

ADC Channels: YES

Inclusion of Analog to Digital Converters allows for precise measurement and conversion of analog signals to digital data.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient and fast processing of instructions, maximizing performance.

Technical Specifications

Microcontrollers LPC11E67JBD100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

80

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

I2C(2), SSP(2), USART(5)

Peripherals:

BOD, COMPARATOR, DMA(16), PWM(6), RTC, TIMER(7), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

LPC11E67JBD100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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