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LPC11E66JBD48E

NXP Semiconductors

LPC11E66JBD48E by NXP Semiconductors

NXP Semiconductors' LPC11E66JBD48E is a 32-bit microcontroller with 3.3V supply, 25MHz clock frequency, and 12288 bytes of RAM. Ideal for industrial applications, it features 8-Ch 12-Bit ADCs, 6 PWM channels, and connectivity options like I2C(2) and USART(4).

Median Price

$4.270

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19 parts In-Stock

1+ parts

$2.060

100+ parts

$2.020

1k+ parts

$1.980

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19

$2.060

$2.020

$1.980

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DigiKey

USA . 465 parts In-Stock

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$4.270

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465

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Flip Electronics (Authorized)

USA . 465 parts In-Stock

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465

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Verical

USA . 250 parts In-Stock

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$4.928

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250

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$4.928

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Distributors (In-Stock)

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Digiode

USA . 3,950 parts In-Stock

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$4.304

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$4.304

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Vyrian

USA . 4,886 parts In-Stock

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4,886

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Anansix

USA . 1,025 parts In-Stock

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Flip Electronics

USA . 465 parts In-Stock

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465

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Nova Conductors

Japan . 35 parts In-Stock

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35

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Distributors (Availability)

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Semicontronic

India . 529 parts In-Stock

1+ parts

$3.850

100+ parts

$3.754

1k+ parts

$3.734

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529

$3.850

$3.754

$3.734

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Ampacity Inc.

Singapore . 245 parts In-Stock

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$3.850

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Corphita

USA . 4,361 parts In-Stock

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$4.077

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Corohmni

South Africa . 20 parts In-Stock

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$5.240

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20

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Vigor

Singapore . 2,320 parts In-Stock

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$5.890

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$5.890

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Aztec Data Supply Inc.

USA . 173 parts In-Stock

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$50.900

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QUARKTWIN TECHNOLOGY LTD

USA . 10,951 parts In-Stock

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Continental Prestige Electronics

USA . 3,305 parts In-Stock

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Microchip USA

USA . 2,406 parts In-Stock

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Lixinc

USA . 1,723 parts In-Stock

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Argo Parts USA

USA . 1,279 parts In-Stock

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Perfect Parts

USA . 840 parts In-Stock

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840

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UNI Independent Distributors

Spain . 248 parts In-Stock

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248

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Unlock the full potential of your projects with the LPC11E66JBD48E by NXP Semiconductors. This top-of-the-line microcontroller offers unparalleled quality and reliability, backed by NXP's reputation as a leading manufacturer in the industry. Ideal for a wide range of applications, this product provides customers with advanced features, high performance, and unmatched value. Experience seamless connectivity, efficient power management, and cutting-edge technology with the LPC11E66JBD48E - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material which helps in keeping the overall weight of the product low.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and facilitating automated assembly.

Maximum Supply Voltage: 3.6 V

Provides a wide operating voltage range, making it suitable for a variety of applications.

Bit Size: 32

Provides high computational power and allows for handling complex tasks efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses RISC architecture which offers high performance and reduced power consumption, making it an efficient choice for embedded systems.

Maximum Clock Frequency: 25 MHz

Delivers fast processing speeds and efficient performance for time-sensitive applications.

ADC Channels: YES

Allows for analog inputs to be converted to digital signals, enabling the microcontroller to interface with sensors and other analog devices.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer, reducing the burden on the CPU and improving overall system performance.

Connectivity: I2C(2), SSP(2), USART(4)

Offers multiple communication interfaces, enhancing the connectivity options for the microcontroller in various applications.

Technical Specifications

Microcontrollers LPC11E66JBD48E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

36

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

I2C(2), SSP(2), USART(4)

Peripherals:

BOD, COMPARATOR, DMA(16), PWM(6), RTC, TIMER(7), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

LPC11E66JBD48E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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