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LPC11E37FBD64/501E

NXP Semiconductors

LPC11E37FBD64/501E by NXP Semiconductors

NXP Semiconductors' LPC11E37FBD64/501E is a 32-bit microcontroller with 3.3V power supply, 25 MHz clock frequency, and 12288 bytes of RAM. Ideal for industrial applications, it features a Cortex-M0 CPU family and FLASH ROM programmability for versatile usage in various electronic systems requiring high-speed processing capabilities.

Median Price

$3.205

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35 parts In-Stock

1+ parts

$2.570

100+ parts

$2.520

1k+ parts

$2.470

10k+ parts

-

35

$2.570

$2.520

$2.470

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Verical

USA . 9,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.840

10k+ parts

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9,920

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-

$3.840

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,419 parts In-Stock

1+ parts

$4.094

100+ parts

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3,419

$4.094

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Flip Electronics

USA . 19,200 parts In-Stock

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19,200

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Vyrian

USA . 8,855 parts In-Stock

1+ parts

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8,855

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Anansix

USA . 2,560 parts In-Stock

1+ parts

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2,560

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 6,500 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

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6,500

$2.860

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Corphita

USA . 1,814 parts In-Stock

1+ parts

$3.879

100+ parts

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1k+ parts

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1,814

$3.879

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AZTECH Wire

Italy . 361 parts In-Stock

1+ parts

$10.310

100+ parts

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361

$10.310

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Microchip USA

USA . 2,815 parts In-Stock

1+ parts

$25.870

100+ parts

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2,815

$25.870

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UNI Independent Distributors

Spain . 3,420 parts In-Stock

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3,420

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Perfect Parts

USA . 179 parts In-Stock

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179

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Overview

Discover the LPC11E37FBD64/501E by NXP Semiconductors, a powerful microcontroller packed with innovative features and top-notch quality. Designed for a wide range of applications, this product offers unmatched value to customers looking for reliable performance and seamless integration. Benefit from the expertise of NXP Semiconductors and unlock endless possibilities with this cutting-edge device. Experience the advantages of advanced technology without compromising on quality - choose LPC11E37FBD64/501E for your next project and elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to various environmental factors, making this microcontroller suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Being able to handle up to 3.6V ensures compatibility with a variety of power sources, making this microcontroller versatile.

Package Shape: SQUARE

Square package shape offers efficient use of PCB real estate and helps in component layout optimization.

Bit Size: 32

32-bit architecture provides enhanced performance, precision, and processing power compared to lower bit counterparts.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable operation and consistent performance of the microcontroller.

No. of Terminals: 64

Having 64 terminals allows for the connection of a wide range of peripherals and components, providing flexibility in system design.

Package Style (Meter): FLATPACK

Flatpack package style offers compactness and space-saving benefits, ideal for applications where size constraints are a consideration.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliability in harsh environments and industrial applications with elevated temperatures.

CPU Family: CORTEX-M0

Cortex-M0 CPU offers low-power consumption, efficient performance, and compatibility with a wide range of development tools and software, making it an optimal choice for embedded applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for operation in cold environments or industrial applications with extreme temperatures.

ADC Channels: YES

Built-in ADC channels enable analog signal processing and conversion, expanding the capabilities of the microcontroller for sensor interfacing and data acquisition.

ROM Words: 131072

Large ROM size of 131072 words provides ample storage capacity for program memory, allowing for complex code implementations and firmware updates.

Width: 10 mm

Compact width of 10mm facilitates space-efficient PCB layout and integration, especially in applications with size constraints.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency of 25 MHz enables fast and efficient processing of instructions, enhancing the overall performance of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture along with peripheral IC type of microcontroller ensures streamlined operations, reduced power consumption, and efficient execution of instructions.

RAM Bytes: 12288

Generous amount of RAM with 12288 bytes enables efficient data storage and processing, facilitating multitasking and data-intensive applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and reliable operation, making the microcontroller energy-efficient and durable.

Terminal Form: GULL WING

Gull wing terminal form offers easy PCB mounting and soldering, ensuring secure connections and reliable performance of the microcontroller.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick firmware updates, customization, and flexibility in code implementation, enhancing the versatility of the microcontroller.

No. of I/O Lines: 54

Having 54 I/O lines provides ample connectivity options for interfacing with external devices, sensors, and peripherals, allowing for versatile system integration and expansion.

Technical Specifications

Microcontrollers LPC11E37FBD64/501E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

54

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LPC11E37FBD64/501E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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