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LPC11E36FBD64/501E

NXP Semiconductors

LPC11E36FBD64/501E by NXP Semiconductors

LPC11E36FBD64/501E by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 54 I/O lines, and operates in -40 °C to 85 °C range. Ideal for industrial applications, it supports ADC channels and has flash ROM for programmability. Its compact flatpack design ensures efficient surface mounting.

Median Price

$4.133

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,920 parts In-Stock

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$4.133

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$4.133

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Flip Electronics (Authorized)

USA . 4,960 parts In-Stock

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4,960

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Rochester

USA . 415 parts In-Stock

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$3.610

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$3.230

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$3.040

415

-

$3.610

$3.230

$3.040

DigiKey

USA . 415 parts In-Stock

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$4.750

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415

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$4.750

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Distributors (In-Stock)

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Digiode

USA . 3,639 parts In-Stock

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$3.468

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3,639

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Flip Electronics

USA . 20,320 parts In-Stock

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Vyrian

USA . 12,289 parts In-Stock

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Anansix

USA . 2,656 parts In-Stock

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DigiKey Marketplace

USA . 615 parts In-Stock

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615

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Distributors (Availability)

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Corphita

USA . 4,893 parts In-Stock

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$3.285

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Component Stockers USA

USA . 839 parts In-Stock

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$4.160

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$3.910

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839

$4.160

$3.910

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Vigor

Singapore . 100 parts In-Stock

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$6.620

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100

$6.620

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Microchip USA

USA . 1,859 parts In-Stock

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$25.350

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1,859

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QUARKTWIN TECHNOLOGY LTD

USA . 17,311 parts In-Stock

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UNI Independent Distributors

Spain . 6,751 parts In-Stock

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Perfect Parts

USA . 358 parts In-Stock

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Overview

Elevate your designs with the LPC11E36FBD64/501E microcontroller from NXP Semiconductors, a leader in advanced technology. Engineered for efficiency and versatility, this 32-bit powerhouse operates seamlessly across various applications, from automation to IoT devices. With its robust performance and low power consumption, you’ll enjoy enhanced reliability and extended battery life, ensuring your innovations stand out while delivering exceptional value and unmatched quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection from environmental factors.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, making it ideal for modern applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V allows for flexibility in power supply options while ensuring safe operation.

Package Shape: SQUARE

The square package shape promotes symmetry and efficient usage of space in multi-chip designs.

Bit Size: 32

The 32-bit architecture provides enhanced processing capabilities, allowing for complex computations and faster performance.

Power Supplies (V): 3.3

Operating at 3.3 V is beneficial for low-power applications, contributing to overall energy efficiency.

No. of Terminals: 64

With 64 terminals, this microcontroller offers ample connectivity options for various peripherals and interfaces.

Package Style (Meter): FLATPACK

The flatpack style simplifies the mounting process and optimizes space on PCB, making it suitable for various applications.

Minimum Supply Voltage: 1.8 V

A minimum supply voltage of 1.8 V enhances versatility, allowing for operation in a wider range of environments.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications, the maximum operating temperature ensures reliability in demanding environments.

CPU Family: CORTEX-M0

The Cortex-M0 CPU family is known for its low power consumption and efficiency, suitable for battery-operated devices.

Minimum Operating Temperature: -40 °C

This feature ensures the microcontroller can withstand extreme cold, making it ideal for automotive and outdoor applications.

Terminal Finish: TIN

A tin finish on terminals helps enhance solderability and overall reliability during assembly.

ADC Channels: YES

Integrated ADC channels provide capabilities for precise analog signal processing, essential for sensor applications.

Terminal Position: QUAD

Quad terminal positioning allows for better stability and ease of mounting on the PCB.

ROM Words: 98304

With 98304 ROM words, there's substantial memory available for program storage, enabling more complex applications.

Width: 10 mm

The compact width facilitates integration into constrained spaces, essential for portable devices.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz provides sufficient processing speed for dynamic applications.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds at peak reflow temperature indicates robust packaging suitable for high-quality soldering processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with modern manufacturing processes for assembly.

Length: 10 mm

The length of 10 mm complements the width, ensuring a compact footprint on PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures the microcontroller operates reliably in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller means it is designed for efficient processing, enabling quick execution of instructions.

RAM Bytes: 12288

A RAM capacity of 12288 bytes supports multiple simultaneous tasks, improving performance in data-intensive applications.

Technology: CMOS

CMOS technology contributes to lower power consumption and higher noise immunity, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals are standard for surface mount technology, ensuring reliable connections during assembly.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V helps ensure consistent performance and compatibility with a wide range of devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the microcontroller’s firmware in the field.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm contributes to a compact design, making the microcontroller suitable for high-density applications.

Moisture Sensitivity Level (MSL): 2

With an MSL rating of 2, it offers moderate handling requirements to prevent moisture-related issues during assembly.

Speed: 50 rpm

Achieving a speed of 50 rpm indicates suitability for applications requiring moderate speed and efficiency.

No. of I/O Lines: 54

Having 54 I/O lines provides extensive options for interfacing with various peripherals, enhancing design flexibility.

Technical Specifications

Microcontrollers LPC11E36FBD64/501E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

54

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

98304

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LPC11E36FBD64/501E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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