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LPC11E14FHN33/401

NXP Semiconductors

LPC11E14FHN33/401 by NXP Semiconductors

LPC11E14FHN33/401 by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, an operating temp range of -40 °C to 85 °C, and 28 I/O lines. Ideal for industrial applications, it offers efficient performance with its Cortex-M0 CPU and integrated ADC channels. Its compact design ensures versatility in various embedded systems.

Median Price

$3.480

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 182 parts In-Stock

1+ parts

$4.640

100+ parts

$2.934

1k+ parts

$2.694

10k+ parts

$2.546

182

$4.640

$2.934

$2.694

$2.546

Mouser Electronics

USA . 245 parts In-Stock

1+ parts

$6.240

100+ parts

$3.510

1k+ parts

$2.990

10k+ parts

$2.670

245

$6.240

$3.510

$2.990

$2.670

Verical

USA . 9,880 parts In-Stock

1+ parts

-

100+ parts

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$2.319

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9,880

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-

$2.319

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Rochester

USA . 61 parts In-Stock

1+ parts

-

100+ parts

$2.230

1k+ parts

$2.000

10k+ parts

$1.880

61

-

$2.230

$2.000

$1.880

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,960 parts In-Stock

1+ parts

$2.138

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4,960

$2.138

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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10,000

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Vyrian

USA . 4,466 parts In-Stock

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4,466

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Anansix

USA . 1,829 parts In-Stock

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1,829

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Chip Stock

USA . 718 parts In-Stock

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718

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Distributors (Availability)

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Vigor

Singapore . 97 parts In-Stock

1+ parts

$1.730

100+ parts

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97

$1.730

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Corphita

USA . 2,447 parts In-Stock

1+ parts

$2.025

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2,447

$2.025

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Microchip USA

USA . 10,067 parts In-Stock

1+ parts

$6.476

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10,067

$6.476

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iodParts Technologies Inc.

India . 10,920 parts In-Stock

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10,920

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Perfect Parts

USA . 3,361 parts In-Stock

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3,361

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UNI Independent Distributors

Spain . 3,174 parts In-Stock

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3,174

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Overview

Unlock innovation with the LPC11E14FHN33/401 from NXP Semiconductors, a leader in high-quality microcontrollers. This versatile 32-bit powerhouse delivers exceptional performance for diverse applications, from industrial automation to consumer electronics. With a robust design and low power requirements, it ensures reliability even in extreme conditions. Elevate your projects with a solution that combines cutting-edge technology and proven manufacturing excellence, driving efficiency and value every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resilience against environmental factors, making it suitable for diverse applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing processes, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

This low maximum supply voltage ensures energy efficiency, which is critical for battery-operated devices.

Package Shape: SQUARE

The square package shape facilitates efficient routing on circuit boards, enhancing layout flexibility.

Bit Size: 32

A 32-bit architecture allows for handling larger data and more complex computations, improving overall performance.

Power Supplies (V): 3.3

The nominal supply voltage of 3.3 V optimizes compatibility with various digital circuits and reduces power consumption.

No. of Terminals: 33

Having 33 terminals provides a good number of I/O options, enhancing connectivity for various peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile with a heat sink offers efficient thermal management, making it suitable for high-performance applications.

Minimum Supply Voltage: 1.8 V

This low minimum supply voltage expands its usability in low-power applications, further enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

The capability to operate at high temperatures makes it suitable for industrial and harsh environment applications.

CPU Family: CORTEX-M0

The Cortex-M0 family is designed for low-power applications, providing an excellent balance between performance and efficiency.

Minimum Operating Temperature: -40 °C

Its ability to function in extreme cold temperatures makes it ideal for outdoor and industrial usage.

ADC Channels: YES

Integrated ADC channels allow for real-time data sampling, essential for applications requiring sensor input.

Terminal Position: QUAD

Quad terminal positioning facilitates easy routing and efficient board design.

ROM Words: 32768

A sizable ROM allows for comprehensive firmware storage, reducing the need for external memory in many applications.

Maximum Seated Height: 1 mm

The very low profile makes it ideal for portable devices where weight and space are critical.

Width: 7 mm

A compact width aids in saving board space while allowing for a high density of components.

Maximum Clock Frequency: 25 MHz

A 25 MHz clock frequency provides sufficient processing power for a wide range of embedded applications.

Peak Reflow Temperature °C: 260

This high reflow temperature indicates compatibility with modern soldering techniques, crucial for quality manufacturing.

Length: 7 mm

A small length complements the compact design, which is especially valuable in mobile applications.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature standards ensures reliability in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture simplifies the instruction set, enhancing efficiency and execution speed.

RAM Bytes: 4096

4 KB of RAM is adequate for most embedded applications, allowing for effective data handling and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for battery-operated devices.

Terminal Form: NO LEAD

No lead terminal form reduces the environmental impact and improves the reliability of solder joints.

Nominal Supply Voltage: 3.3 V

The common nominal supply voltage enhances compatibility across various systems and peripherals.

ROM Programmability: FLASH

Flash ROM allows for easy updates and reprogramming, adding versatility to the product.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch helps in achieving a compact layout without compromising on performance.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates reasonable resistance to moisture, making it suitable for a variety of environments.

Speed: 50 rpm

Capable of 50 rpm adds flexibility in applications requiring controlled speed, like motor management.

No. of I/O Lines: 28

Having 28 I/O lines facilitates extensive interfacing capabilities with sensors and actuators, maximizing application potential.

Technical Specifications

Microcontrollers LPC11E14FHN33/401 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N33

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LPC11E14FHN33/401 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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