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LPC11E12FBD48/201

NXP Semiconductors

LPC11E12FBD48/201 by NXP Semiconductors

LPC11E12FBD48/201 by NXP is a 32-bit microcontroller with Cortex-M0 CPU, 3.3V power supply, and 25MHz clock frequency. Ideal for industrial applications, it features 1024 bytes of RAM, FLASH ROM programmability, and operates in temperatures ranging from -40 to 85°C.

Median Price

$2.226

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 99 parts In-Stock

1+ parts

$5.280

100+ parts

$2.970

1k+ parts

$2.320

10k+ parts

$2.260

99

$5.280

$2.970

$2.320

$2.260

Verical

USA . 10,000 parts In-Stock

1+ parts

-

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$1.963

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-

$1.963

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Rochester

USA . 696 parts In-Stock

1+ parts

-

100+ parts

$1.890

1k+ parts

$1.690

10k+ parts

$1.590

696

-

$1.890

$1.690

$1.590

DigiKey

USA . 696 parts In-Stock

1+ parts

-

100+ parts

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$2.490

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696

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$2.490

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Distributors (In-Stock)

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Digiode

USA . 2,303 parts In-Stock

1+ parts

$1.814

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2,303

$1.814

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Vyrian

USA . 4,336 parts In-Stock

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4,336

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Anansix

USA . 2,595 parts In-Stock

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2,595

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DigiKey Marketplace

USA . 696 parts In-Stock

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696

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Distributors (Availability)

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Corphita

USA . 3,977 parts In-Stock

1+ parts

$1.719

100+ parts

-

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3,977

$1.719

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Vigor

Singapore . 237 parts In-Stock

1+ parts

$3.850

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237

$3.850

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Microchip USA

USA . 9,004 parts In-Stock

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$28.600

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$28.600

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UNI Independent Distributors

Spain . 1,534 parts In-Stock

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Overview

Discover the LPC11E12FBD48/201 by NXP Semiconductors, a high-quality microcontroller designed to meet your industrial needs. With its advanced features and reliable performance, this product offers exceptional value to customers in various applications. Whether you're looking for efficient power supplies or seamless integration, this microcontroller delivers unparalleled benefits. Upgrade your projects with the LPC11E12FBD48/201 and experience the advantages of cutting-edge technology from a trusted manufacturer like NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying assembly process.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options, allowing compatibility with a wide range of systems.

Package Shape: SQUARE

Facilitates efficient layout and design of circuit boards.

Bit Size: 32

Offers high processing capability and performance for various applications.

Power Supplies (V): 3.3

Operates efficiently at a commonly used voltage level, ensuring compatibility with existing systems.

No. of Terminals: 48

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables compact and low-profile designs, ideal for space-constrained applications.

Minimum Supply Voltage: 1.8 V

Allows for operation in low-power environments, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature conditions.

CPU Family: CORTEX-M0

Belongs to a well-established and efficient CPU family, providing reliable processing power.

Minimum Operating Temperature: -40 °C

Maintains functionality in extreme cold environments.

ADC Channels: YES

Enables analog-to-digital conversion for a wide range of sensor integration possibilities.

Terminal Position: QUAD

Facilitates easy and organized connection with external devices.

ROM Words: 16384

Offers sufficient memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Suits applications with height restrictions, allowing for more versatile integration.

Width: 7 mm

Compact width size saves space on the circuit board.

Maximum Clock Frequency: 25 MHz

Provides fast and responsive operation for real-time applications.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes during manufacturing.

Length: 7 mm

Optimal length for efficient board layout and space utilization.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Combines the benefits of microcontroller and RISC architecture for efficient and streamlined processing.

RAM Bytes: 1024

Offers sufficient memory for data storage and manipulation during operation.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Provides a reliable and secure terminal connection for long-term performance.

Nominal Supply Voltage: 3.3 V

Operates optimally at a common supply voltage with stable performance.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates of firmware and software.

Terminal Pitch: 0.5 mm

Offers precise and compact terminal spacing for efficient circuit design.

Moisture Sensitivity Level (MSL): 3

Indicates a moderate level of sensitivity to moisture, suitable for controlled environments.

Speed: 50 rpm

Operates at a moderate speed suitable for various applications.

No. of I/O Lines: 40

Provides ample input/output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LPC11E12FBD48/201 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LPC11E12FBD48/201 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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