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LPC11D14FBD100/302

NXP Semiconductors

LPC11D14FBD100/302 by NXP Semiconductors

NXP Semiconductors' LPC11D14FBD100/302 is a 32-bit microcontroller with 3.3V supply, 25MHz clock frequency, and Cortex-M0 CPU ideal for industrial applications. Featuring 42 I/O lines, FLASH ROM programmability, and 8192 bytes of RAM, this low-profile chip operates b/w -40 to 85°C temperatures.

Median Price

$3.412

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 54 parts In-Stock

1+ parts

$8.050

100+ parts

$4.840

1k+ parts

$4.120

10k+ parts

$3.770

54

$8.050

$4.840

$4.120

$3.770

Rochester

USA . 3,799 parts In-Stock

1+ parts

-

100+ parts

$3.380

1k+ parts

$3.030

10k+ parts

$2.850

3,799

-

$3.380

$3.030

$2.850

DigiKey

USA . 1,231 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.990

10k+ parts

-

1,231

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-

$2.990

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Verical

USA . 1,231 parts In-Stock

1+ parts

-

100+ parts

-

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$3.444

10k+ parts

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1,231

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-

$3.444

-

Flip Electronics (Authorized)

USA . 1,231 parts In-Stock

1+ parts

-

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-

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1,231

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 115 parts In-Stock

1+ parts

$2.954

100+ parts

-

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-

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115

$2.954

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$3.411

100+ parts

-

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500

$3.411

-

-

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Vyrian

USA . 4,741 parts In-Stock

1+ parts

-

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4,741

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Flip Electronics

USA . 4,021 parts In-Stock

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4,021

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Anansix

USA . 916 parts In-Stock

1+ parts

-

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916

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 594 parts In-Stock

1+ parts

$2.640

100+ parts

-

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594

$2.640

-

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Corphita

USA . 2,376 parts In-Stock

1+ parts

$2.799

100+ parts

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2,376

$2.799

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Netroflash

USA . 500 parts In-Stock

1+ parts

$3.411

100+ parts

-

1k+ parts

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500

$3.411

-

-

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Vigor

Singapore . 52 parts In-Stock

1+ parts

$5.630

100+ parts

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52

$5.630

-

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Microchip USA

USA . 2,126 parts In-Stock

1+ parts

$20.048

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2,126

$20.048

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UNI Independent Distributors

Spain . 5,556 parts In-Stock

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5,556

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Lixinc

USA . 2,097 parts In-Stock

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2,097

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Kepictronics

USA . 213 parts In-Stock

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213

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Perfect Parts

USA . 100 parts In-Stock

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100

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Overview

Unlock the endless possibilities with the LPC11D14FBD100/302 microcontroller from NXP Semiconductors. Designed with cutting-edge technology, this device offers unparalleled performance and reliability in a compact package. Ideal for a wide range of applications, from IoT devices to industrial automation, this microcontroller provides seamless integration and efficient operation. With NXP's reputation for quality and innovation backing it up, you can trust that the LPC11D14FBD100/302 will exceed your expectations. Experience the difference today and revolutionize your projects with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of voltage inputs, making the microcontroller versatile and compatible with various power sources.

CPU Family: CORTEX-M0

The Cortex-M0 architecture provides high performance and efficiency, making the microcontroller suitable for various applications.

RAM Bytes: 8192

With a generous amount of RAM, the microcontroller can efficiently handle data processing and storage tasks.

Maximum Clock Frequency: 25 MHz

The high clock frequency enables fast data processing and execution, ensuring quick response times in applications.

ROM Programmability: FLASH

The flash ROM allows for easy reprogramming of the microcontroller, enabling flexibility and quick updates to the system.

Technical Specifications

Microcontrollers LPC11D14FBD100/302 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

42

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LPC11D14FBD100/302 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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