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LPC11A14FBD48/301

NXP Semiconductors

LPC11A14FBD48/301 by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

Median Price

$5.500

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 299 parts In-Stock

1+ parts

$5.500

100+ parts

$3.510

1k+ parts

$3.153

10k+ parts

$3.063

299

$5.500

$3.510

$3.153

$3.063

Mouser Electronics

USA . 510 parts In-Stock

1+ parts

$7.050

100+ parts

$4.370

1k+ parts

$3.300

10k+ parts

-

510

$7.050

$4.370

$3.300

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Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.797

10k+ parts

-

10,000

-

-

$2.797

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,474 parts In-Stock

1+ parts

$3.325

100+ parts

-

1k+ parts

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10k+ parts

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3,474

$3.325

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Flip Electronics

USA . 62,898 parts In-Stock

1+ parts

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100+ parts

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62,898

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10,000

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Vyrian

USA . 4,580 parts In-Stock

1+ parts

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4,580

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Anansix

USA . 2,467 parts In-Stock

1+ parts

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2,467

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,801 parts In-Stock

1+ parts

$3.150

100+ parts

-

1k+ parts

-

10k+ parts

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2,801

$3.150

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-

-

Authorized Procurement Solutions

USA . 9,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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9,500

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Microchip USA

USA . 7,744 parts In-Stock

1+ parts

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100+ parts

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7,744

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UNI Independent Distributors

Spain . 7,272 parts In-Stock

1+ parts

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7,272

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Perfect Parts

USA . 261 parts In-Stock

1+ parts

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100+ parts

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261

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Technical Specifications

Microcontrollers LPC11A14FBD48/301 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

42

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.6 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

I2C, SSP(2), USART

Peripherals:

BOR, COMPARATOR, POR, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC11A14FBD48/301 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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