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LPC11A13FHI33/201

NXP Semiconductors

LPC11A13FHI33/201 by NXP Semiconductors

NXP Semiconductors' LPC11A13FHI33/201 microcontroller features a 32-bit CPU, 3.3V power supply, and 8-Ch 10-Bit ADC channels. Ideal for industrial applications requiring a max clock frequency of 25 MHz, with connectivity options like I2C and USART for versatile integration.

Median Price

$4.870

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 429 parts In-Stock

1+ parts

$4.870

100+ parts

$3.090

1k+ parts

$2.720

10k+ parts

$2.670

429

$4.870

$3.090

$2.720

$2.670

DigiKey

USA . 425 parts In-Stock

1+ parts

$4.870

100+ parts

$3.084

1k+ parts

$2.765

10k+ parts

$2.671

425

$4.870

$3.084

$2.765

$2.671

Verical

USA . 490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.777

10k+ parts

$2.652

490

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-

$2.777

$2.652

Distributors (In-Stock)

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Digiode

USA . 4,092 parts In-Stock

1+ parts

$3.059

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4,092

$3.059

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Vyrian

USA . 6,570 parts In-Stock

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6,570

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Flip Electronics

USA . 2,940 parts In-Stock

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2,940

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Anansix

USA . 2,827 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 490 parts In-Stock

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490

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Nova Conductors

Japan . 57 parts In-Stock

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57

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 347 parts In-Stock

1+ parts

$2.710

100+ parts

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347

$2.710

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Corphita

USA . 4,141 parts In-Stock

1+ parts

$2.898

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4,141

$2.898

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Microchip USA

USA . 8,061 parts In-Stock

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$15.316

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8,061

$15.316

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Corohmni

South Africa . 266 parts In-Stock

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$26.240

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266

$26.240

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UNI Independent Distributors

Spain . 6,981 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Continental Prestige Electronics

USA . 1,999 parts In-Stock

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1,999

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Argo Parts USA

USA . 1,025 parts In-Stock

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1,025

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Perfect Parts

USA . 585 parts In-Stock

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585

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Overview

Enhance your electronic designs with the LPC11A13FHI33/201 microcontroller by NXP Semiconductors. Featuring cutting-edge technology and reliable performance, this versatile chip is perfect for a wide range of applications. From IoT devices to consumer electronics, this product offers unmatched value and benefits. Trust in NXP Semiconductors' reputation for quality and innovation, and unlock endless possibilities for your projects with the LPC11A13FHI33/201. Upgrade your creations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product more affordable and easier to handle.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of power sources.

Bit Size: 32

With a larger bit size, the microcontroller can handle more complex operations and calculations, making it suitable for a variety of applications.

ADC Channels: YES

Having Analog to Digital Converter channels allows the microcontroller to interface with analog sensors and devices, broadening its capability.

Maximum Clock Frequency: 25 MHz

A high clock frequency enables fast processing speeds, making the microcontroller efficient for real-time applications.

RAM Bytes: 6144

A generous amount of Random Access Memory provides ample storage for data and variables, allowing for more complex algorithms to be executed.

Connectivity: I2C, SSP(2), USART

Multiple connectivity options make it easy to integrate the microcontroller into various systems and communicate with other devices.

Technical Specifications

Microcontrollers LPC11A13FHI33/201 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

SEATED HGT-NOM

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

.85 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.6 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

I2C, SSP(2), USART

Peripherals:

BOR, COMPARATOR, POR, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC11A13FHI33/201 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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