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LPC11A12FHN33/101

NXP Semiconductors

LPC11A12FHN33/101 by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 33; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$3.283

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 230 parts In-Stock

1+ parts

$4.200

100+ parts

$2.648

1k+ parts

-

10k+ parts

-

230

$4.200

$2.648

-

-

Mouser Electronics

USA . 182 parts In-Stock

1+ parts

$5.900

100+ parts

$3.320

1k+ parts

$2.820

10k+ parts

$2.530

182

$5.900

$3.320

$2.820

$2.530

Flip Electronics (Authorized)

USA . 9,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,525

-

-

-

-

Verical

USA . 9,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.366

10k+ parts

-

9,360

-

-

$2.366

-

Rochester

USA . 489 parts In-Stock

1+ parts

-

100+ parts

$2.120

1k+ parts

$1.900

10k+ parts

$1.780

489

-

$2.120

$1.900

$1.780

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,175 parts In-Stock

1+ parts

$2.024

100+ parts

-

1k+ parts

-

10k+ parts

-

4,175

$2.024

-

-

-

Flip Electronics

USA . 9,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,525

-

-

-

-

Vyrian

USA . 5,762 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,762

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-

-

-

Anansix

USA . 2,410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,410

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,024 parts In-Stock

1+ parts

$1.810

100+ parts

-

1k+ parts

-

10k+ parts

-

2,024

$1.810

-

-

-

Corphita

USA . 116 parts In-Stock

1+ parts

$1.917

100+ parts

-

1k+ parts

-

10k+ parts

-

116

$1.917

-

-

-

Microchip USA

USA . 4,572 parts In-Stock

1+ parts

$31.915

100+ parts

-

1k+ parts

-

10k+ parts

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4,572

$31.915

-

-

-

UNI Independent Distributors

Spain . 4,915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,915

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

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Perfect Parts

USA . 358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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358

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-

Technical Specifications

Microcontrollers LPC11A12FHN33/101 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.6 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1024

Connectivity:

I2C, SSP(2), USART

Peripherals:

BOR, COMPARATOR, POR, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC11A12FHN33/101 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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