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LPC1114JBD48/323QL

NXP Semiconductors

LPC1114JBD48/323QL by NXP Semiconductors

LPC1114JBD48/323QL by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 8 ADC channels, and operates in -40 °C to 105 °C range. Ideal for industrial applications, it supports I2C, SPI, and UART connectivity. With 49152 ROM words and 8192 bytes RAM, it's perfect for embedded systems.

Median Price

$2.588

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 10,000 parts In-Stock

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$2.588

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$2.588

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Digiode

USA . 3,022 parts In-Stock

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Anansix

USA . 2,495 parts In-Stock

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2,495

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Vyrian

USA . 1,941 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 2,814 parts In-Stock

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$3.580

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AZTECH Wire

Italy . 148 parts In-Stock

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$9.550

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Microchip USA

USA . 1,972 parts In-Stock

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$24.109

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One Stop Electronics

USA . 296 parts In-Stock

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$28.000

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UNI Independent Distributors

Spain . 7,778 parts In-Stock

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Corphita

USA . 3,428 parts In-Stock

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Overview

Unlock the power of innovation with the LPC1114JBD48/323QL microcontroller from NXP Semiconductors. Designed for versatility and reliability, this 32-bit solution excels in industrial applications, offering superior performance in compact designs. With a robust temperature range and energy-efficient operation, it ensures seamless connectivity and integration. Trust NXP's legacy of quality to elevate your projects, maximizing efficiency while minimizing time-to-market. Experience excellence with every application!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and efficient thermal management, making the microcontroller suitable for a variety of environments.

Surface Mount: YES

Surface mount technology allows for a compact design, making it easy to integrate into modern circuit boards with limited space.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V is suitable for low-power applications, contributing to energy efficiency.

Package Shape: SQUARE

A square package shape provides consistent layout and easy physical integration into PCB designs.

Bit Size: 32

The 32-bit architecture allows for high processing power, enabling the handling of complex applications and data.

Power Supplies (V): 3.3

Operating at 3.3 V is ideal for compatibility with modern digital circuits and reduces power consumption.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for various peripherals, enhancing the functionality of the microcontroller.

Package Style (Meter): FLATPACK

Flatpack design aids in easy mounting on PCBs and offers mechanical strength.

Minimum Supply Voltage: 1.8 V

This low minimum supply voltage expands the microcontroller's usability in battery-powered applications.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature makes this microcontroller suitable for industrial applications in harsh environments.

CPU Family: CORTEX-M0

The Cortex-M0 CPU family is known for its power efficiency and is widely supported, making development easier.

Minimum Operating Temperature: -40 °C

The ability to operate at very low temperatures makes this microcontroller ideal for outdoor and extreme conditions.

Terminal Finish: TIN

Tin finish provides reliable solderability and enhances durability against oxidation.

ADC Channels: YES

Integrated ADC channels facilitate the conversion of analog signals, which is essential for sensor integration.

Terminal Position: QUAD

Quad terminal positioning improves layout flexibility and allows for easier routing on PCBs.

ROM Words: 49152

A generous ROM size enables the storage of complex firmware and applications directly on-chip.

Width: 7 mm

The compact width makes it easy to fit in space-constrained designs while still delivering strong performance.

Peripherals: BOD, POR, TIMER(5), WDT

Built-in peripherals enhance the versatility of the microcontroller for various control and monitoring tasks.

Maximum Clock Frequency: 25 MHz

A 25 MHz clock frequency allows for efficient processing speed for various embedded applications.

Maximum Time At Peak Reflow Temperature (s): 30

Capability to withstand peak reflow temperatures ensures the microcontroller is suitable for industrial soldering processes.

Peak Reflow Temperature °C: 260

A high peak reflow temperature rating ensures compatibility with modern reflow soldering techniques.

Length: 7 mm

Short length enhances its application in portable and compact devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grading assures reliability in demanding industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture optimizes instruction execution, leading to improved performance and power efficiency.

RAM Bytes: 8192

8 KB of RAM supports various data handling capabilities making it suitable for intricate applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, crucial for battery-operated devices.

Terminal Form: GULL WING

Gull wing leads provide good mechanical strength and ease of soldering on PCB.

Analog To Digital Converters: 8-Ch 10-Bit

The presence of an 8-channel 10-bit ADC allows for the simultaneous acquisition of multiple analog signals.

Nominal Supply Voltage: 3.3 V

A stable nominal supply voltage ensures reliable and consistent performance in various applications.

Connectivity: I2C, SPI(2), UART

Diverse connectivity options facilitate easy integration with a variety of sensors and modules.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and reprogramming of application software.

Terminal Pitch: 0.5 mm

A fine terminal pitch supports high-density placements, making it fit for sophisticated designs.

Speed: 50 rpm

The operational speed enhances performance in control applications, supporting efficient processing.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides ample instruction set capabilities while keeping the overall architecture simple.

No. of I/O Lines: 42

Having 42 I/O lines enables extensive interfacing capabilities with peripherals and simplifies hardware design.

Technical Specifications

Microcontrollers LPC1114JBD48/323QL attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

42

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

49152

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1114JBD48/323QL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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