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LPC1114JBD48/303QL

NXP Semiconductors

LPC1114JBD48/303QL by NXP Semiconductors

LPC1114JBD48/303QL by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 8 ADC channels, and operates in -40 °C to 105 °C range. Ideal for industrial applications, it supports I2C, SPI, and UART connectivity. With 8KB RAM and flash ROM, it's perfect for embedded systems.

Median Price

$3.025

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 220 parts In-Stock

1+ parts

-

100+ parts

$2.610

1k+ parts

$2.340

10k+ parts

$2.200

220

-

$2.610

$2.340

$2.200

DigiKey

USA . 220 parts In-Stock

1+ parts

-

100+ parts

$3.440

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220

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$3.440

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Distributors (In-Stock)

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Digiode

USA . 3,385 parts In-Stock

1+ parts

$2.508

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3,385

$2.508

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Flip Electronics

USA . 8,500 parts In-Stock

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8,500

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Vyrian

USA . 6,548 parts In-Stock

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6,548

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Anansix

USA . 2,135 parts In-Stock

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2,135

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DigiKey Marketplace

USA . 220 parts In-Stock

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220

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Distributors (Availability)

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Ampacity Inc.

Singapore . 83 parts In-Stock

1+ parts

$2.240

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83

$2.240

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Corphita

USA . 4,298 parts In-Stock

1+ parts

$2.376

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4,298

$2.376

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Vigor

Singapore . 1,800 parts In-Stock

1+ parts

$3.754

100+ parts

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1,800

$3.754

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Microchip USA

USA . 4,559 parts In-Stock

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4,559

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UNI Independent Distributors

Spain . 1,570 parts In-Stock

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1,570

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Overview

Elevate your projects with the LPC1114JBD48/303QL microcontroller from NXP Semiconductors, a trusted leader in innovation and quality. Designed to deliver exceptional performance in demanding environments, this 32-bit Cortex-M0 MCU boasts robust features like versatile connectivity options and efficient power management. Perfect for industrial automation, IoT devices, and consumer electronics, it ensures reliability and scalability, empowering you to create cutting-edge solutions with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliability and protection in various environments.

Surface Mount: YES

Facilitates easy integration into modern PCB designs, reducing space and allowing for higher-density layouts.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a range of power supply systems commonly used in embedded applications.

Package Shape: SQUARE

Provides a compact footprint ideal for space-constrained applications.

Bit Size: 32

Enables more complex processing capabilities and improved performance for advanced applications.

Power Supplies (V): 3.3

Standard voltage level provides ease of integration with other common components and lowers power consumption.

No. of Terminals: 48

Offers ample connectivity options for interfacing with other hardware or sensors.

Package Style (Meter): FLATPACK

Allows for efficient heat dissipation and easier automated assembly processes.

Minimum Supply Voltage: 1.8 V

Supports low-power applications, extending battery life in handheld devices.

Maximum Operating Temperature: 105 °C

Ensures reliable operation in high-temperature environments, suitable for industrial applications.

CPU Family: CORTEX-M0

Provides energy efficiency and performance benefits, making it ideal for low-power applications.

Minimum Operating Temperature: -40 °C

Allows it to function effectively in extremely cold conditions, enhancing versatility.

Terminal Finish: TIN

Ensures good solderability and durability during electronic manufacturing.

ADC Channels: YES

Incorporates analog-to-digital conversion capabilities for interfacing with sensors.

Terminal Position: QUAD

Facilitates simplified routing and connectivity on compact circuit boards.

ROM Words: 32768

Provides sufficient program memory for typical embedded applications.

Width: 7 mm

A compact width that saves space on the PCB, ideal for portable devices.

Peripherals: BOD, POR, TIMER(5), WDT

Includes essential peripherals that enhance functionality and reliability in various applications.

Maximum Clock Frequency: 25 MHz

Delivers adequate processing speed for a wide range of tasks without excessive power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

Optimizes manufacturing processes by accommodating standard reflow soldering techniques.

Peak Reflow Temperature °C: 260

Allows for soldering compatibility with various surface mount technologies.

Length: 7 mm

A minimized length that is beneficial for compact electronic designs.

Temperature Grade: INDUSTRIAL

Ensures robustness for demanding industrial applications, providing long-term reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

Offers a high-performance, reduced instruction set for efficient processing.

RAM Bytes: 8192

Provides sufficient memory for temporary data storage in complex applications.

Technology: CMOS

Delivers low power consumption with high speed, improving battery-operated device efficiency.

Terminal Form: GULL WING

Facilitates easy soldering and rework in assembly processes, enhancing manufacturability.

Analog To Digital Converters: 8-Ch 10-Bit

Enables precise measurement and digitization of analog signals for various sensing applications.

Nominal Supply Voltage: 3.3 V

Standard operating voltage aids in compatibility with a range of components.

Connectivity: I2C, SPI(2), UART

Offers versatile communication options for connecting to various peripherals and systems.

ROM Programmability: FLASH

Allows for easy updating and reprogramming of firmware, enhancing longevity and flexibility.

Terminal Pitch: 0.5 mm

Enables high-density layout designs to accommodate complex projects in compact spaces.

Speed: 50 rpm

Suitable for applications requiring speed control, particularly in motor-driven systems.

On Chip Program ROM Width: 8

Simplifies data handling and programming while enhancing compatibility and efficiency.

No. of I/O Lines: 42

Provides a robust interface for connecting multiple devices, facilitating complex embedded designs.

Technical Specifications

Microcontrollers LPC1114JBD48/303QL attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

42

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1114JBD48/303QL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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