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LPC1114FHN33/302K

NXP Semiconductors

LPC1114FHN33/302K by NXP Semiconductors

NXP Semiconductors' LPC1114FHN33/302K is a 32-bit microcontroller with 8KB RAM, 32768 ROM words, and ADC channels. Ideal for industrial applications, it operates b/w -40 to 85°C with a max clock frequency of 25MHz. Features include BOD, POR, TIMER(5), WDT peripherals and connectivity via I2C, SPI, UART interfaces.

Median Price

$3.870

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 800 parts In-Stock

1+ parts

$3.870

100+ parts

$2.390

1k+ parts

$2.010

10k+ parts

-

800

$3.870

$2.390

$2.010

-

DigiKey

USA . 1,300 parts In-Stock

1+ parts

$4.220

100+ parts

$2.654

1k+ parts

$2.433

10k+ parts

$2.297

1,300

$4.220

$2.654

$2.433

$2.297

Mouser Electronics

USA . 63 parts In-Stock

1+ parts

$5.070

100+ parts

$2.940

1k+ parts

$2.370

10k+ parts

-

63

$5.070

$2.940

$2.370

-

Verical

USA . 11,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.085

11,700

-

-

-

$2.085

Rochester

USA . 2,600 parts In-Stock

1+ parts

-

100+ parts

$1.830

1k+ parts

$1.640

10k+ parts

$1.540

2,600

-

$1.830

$1.640

$1.540

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,222 parts In-Stock

1+ parts

$1.928

100+ parts

-

1k+ parts

-

10k+ parts

-

2,222

$1.928

-

-

-

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$2.954

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$2.954

-

-

-

Maritex

Poland . 2,547 parts In-Stock

1+ parts

$7.541

100+ parts

$3.490

1k+ parts

$3.120

10k+ parts

-

2,547

$7.541

$3.490

$3.120

-

Vyrian

USA . 3,865 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,865

-

-

-

-

Anansix

USA . 618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

618

-

-

-

-

Micros

Poland . 130 parts In-Stock

1+ parts

-

100+ parts

$2.983

1k+ parts

$2.919

10k+ parts

-

130

-

$2.983

$2.919

-

Partservice

France . 120 parts In-Stock

1+ parts

-

100+ parts

$2.908

1k+ parts

$2.846

10k+ parts

$2.846

120

-

$2.908

$2.846

$2.846

Micros sp.j. W. Kędra i J. Lic

Poland . 120 parts In-Stock

1+ parts

-

100+ parts

$3.115

1k+ parts

$3.048

10k+ parts

$3.048

120

-

$3.115

$3.048

$3.048

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,384 parts In-Stock

1+ parts

$1.730

100+ parts

$1.687

1k+ parts

$1.678

10k+ parts

-

1,384

$1.730

$1.687

$1.678

-

Ampacity Inc.

Singapore . 1,236 parts In-Stock

1+ parts

$1.730

100+ parts

-

1k+ parts

-

10k+ parts

-

1,236

$1.730

-

-

-

Corphita

USA . 2,642 parts In-Stock

1+ parts

$1.827

100+ parts

-

1k+ parts

-

10k+ parts

-

2,642

$1.827

-

-

-

Continental Prestige Electronics

USA . 3,830 parts In-Stock

1+ parts

$2.889

100+ parts

-

1k+ parts

-

10k+ parts

$2.831

3,830

$2.889

-

-

$2.831

Argo Parts USA

USA . 984 parts In-Stock

1+ parts

$2.889

100+ parts

-

1k+ parts

-

10k+ parts

-

984

$2.889

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$2.895

100+ parts

-

1k+ parts

$2.779

10k+ parts

-

100

$2.895

-

$2.779

-

Microchip USA

USA . 2,067 parts In-Stock

1+ parts

$30.420

100+ parts

-

1k+ parts

-

10k+ parts

-

2,067

$30.420

-

-

-

Corohmni

South Africa . 607 parts In-Stock

1+ parts

$39.432

100+ parts

-

1k+ parts

-

10k+ parts

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607

$39.432

-

-

-

Aztec Data Supply Inc.

USA . 1,157 parts In-Stock

1+ parts

$46.470

100+ parts

-

1k+ parts

-

10k+ parts

-

1,157

$46.470

-

-

-

Modulus Dynamics

Lithuania . 2,408 parts In-Stock

1+ parts

$54.050

100+ parts

$54.050

1k+ parts

$54.050

10k+ parts

-

2,408

$54.050

$54.050

$54.050

-

Lixinc

USA . 5,107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,107

-

-

-

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UNI Independent Distributors

Spain . 4,989 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,989

-

-

-

-

Glotronic Ltd.

UK . 576 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

576

-

-

-

-

Overview

Discover the LPC1114FHN33/302K by NXP Semiconductors, a powerful microcontroller that combines top-notch quality with cutting-edge technology. Designed for a wide range of applications, this product offers unmatched performance and reliability. With its advanced features and innovative design, customers can expect seamless integration and enhanced functionality in their projects. Trust NXP Semiconductors to deliver exceptional products that provide value, benefits, and advantages to meet all your needs. Elevate your projects with the LPC1114FHN33/302K and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

Provides a wide operating voltage range for versatile applications.

On Chip Data RAM Width: 8

Sufficient data RAM width for efficient data processing.

Package Shape: SQUARE

Space-efficient design for compact electronic devices.

Bit Size: 32

High bit size for effective processing of complex algorithms.

No. of Terminals: 33

Sufficient terminals for connecting various components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles for different mounting requirements.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage for energy-efficient operation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial environments.

CPU Family: CORTEX-M0

Efficient and reliable CPU family for high-performance applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures without issues.

ADC Channels: YES

Analog to digital converter channels for accurate sensor data conversion.

Terminal Position: QUAD

Quad terminal position for easy soldering and mounting on PCBs.

ROM Words: 32768

Large ROM capacity for storing program instructions.

Maximum Seated Height: 1 mm

Low seated height for slim and compact device designs.

Width: 7 mm

Compact width for space-constrained applications.

Peripherals: BOD, POR, TIMER(5), WDT

Multiple peripherals for enhanced functionality and system control.

Maximum Clock Frequency: 25 MHz

High clock frequency for fast processing speed.

Peak Reflow Temperature °C: 260

Able to withstand high reflow temperatures during assembly.

Length: 7 mm

Space-saving length for compact device designs.

Temperature Grade: INDUSTRIAL

Designed for reliable operation in industrial temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient data processing in microcontroller applications.

No. of Timers: 5

Multiple timers for accurate time-sensitive operations.

RAM Bytes: 8192

Sufficient RAM capacity for data storage and manipulation.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: NO LEAD

No lead terminals for environmentally friendly and RoHS-compliant design.

Analog To Digital Convertors: 8-Ch 10-Bit

8-channel, 10-bit ADC for precise analog signal conversion.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent operation.

Connectivity: I2C, SPI, UART

Multiple communication interfaces for seamless connectivity with other devices.

ROM Programmability: FLASH

Flash ROM programmability for easy and quick firmware updates.

Terminal Pitch: 0.65 mm

Fine pitch terminals for high-density PCB integration.

Format: FIXED POINT

Fixed-point format for efficient numerical calculations.

Moisture Sensitivity Level (MSL): 3

MSL level 3 for extended shelf life and moisture resistance.

Speed: 50 rpm

Fast processing speed for real-time applications.

Low Power Mode: YES

Low power mode for energy-efficient operation and extended battery life.

On Chip Program ROM Width: 8

Program ROM width for storing firmware and program instructions.

No. of I/O Lines: 28

Sufficient I/O lines for interfacing with external peripherals and sensors.

Technical Specifications

Microcontrollers LPC1114FHN33/302K attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N33

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Serial I/Os:

1

No. of Terminals:

33

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC33,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1114FHN33/302K Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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