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LPC1114FHN33/203,5

NXP Semiconductors

LPC1114FHN33/203,5 by NXP Semiconductors

LPC1114FHN33/203,5 from NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V and operates in -40 °C to 85 °C range. It includes 8 ADC channels and supports I2C, SPI, and UART for versatile applications in industrial automation. Its compact design makes it ideal for space-constrained environments.

Median Price

$1.947

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,880 parts In-Stock

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$1.984

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9,880

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$1.984

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Rochester

USA . 100 parts In-Stock

1+ parts

-

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$1.910

1k+ parts

$1.710

10k+ parts

$1.610

100

-

$1.910

$1.710

$1.610

Distributors (In-Stock)

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Digiode

USA . 3,135 parts In-Stock

1+ parts

$1.834

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3,135

$1.834

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Vyrian

USA . 5,242 parts In-Stock

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5,242

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Anansix

USA . 2,891 parts In-Stock

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2,891

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Flip Electronics

USA . 1,085 parts In-Stock

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1,085

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NAC Semi

USA . 520 parts In-Stock

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$2.010

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520

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$2.010

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Distributors (Availability)

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Corphita

USA . 2,395 parts In-Stock

1+ parts

$1.737

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2,395

$1.737

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Andel Nordic

Denmark . 562 parts In-Stock

1+ parts

$2.810

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$1.970

10k+ parts

$1.970

562

$2.810

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$1.970

$1.970

Microchip USA

USA . 6,111 parts In-Stock

1+ parts

$18.486

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6,111

$18.486

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AZTECH Wire

Italy . 494 parts In-Stock

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$19.560

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494

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QUARKTWIN TECHNOLOGY LTD

USA . 11,090 parts In-Stock

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UNI Independent Distributors

Spain . 5,288 parts In-Stock

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Perfect Parts

USA . 582 parts In-Stock

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Overview

Unlock endless possibilities with the LPC1114FHN33/203,5 from NXP Semiconductors. This robust 32-bit microcontroller blends exceptional quality and reliability, perfect for diverse applications from industrial automation to IoT devices. With a compact design and efficient power management, it delivers outstanding performance while optimizing space. Trust in NXP’s innovation and expertise to elevate your projects, ensuring seamless connectivity and advanced functionality at every turn!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and cost-effectiveness, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient assembly processes.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V enables compatibility with a wide range of power supply systems.

Package Shape: SQUARE

The square form factor aids in efficient space utilization on PCBs.

Bit Size: 32

The 32-bit architecture provides greater processing power and allows for more complex applications.

Power Supplies (V): 3.3

Operating at 3.3 V enhances energy efficiency, which is critical for battery-powered devices.

No. of Terminals: 33

A higher number of terminals allows for extensive interfacing capabilities with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style enhances thermal performance and fits in tight spaces, advantageous for modern designs.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage supports low-power applications and extends battery life.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the device can function reliably in challenging environments.

CPU Family: CORTEX-M0

The Cortex-M0 family is known for low power consumption and high efficiency, ideal for embedded systems.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme low temperatures makes it suitable for industrial and outdoor applications.

ADC Channels: YES

Built-in ADC channels facilitate the integration of analog sensors, adding versatility to the device.

Terminal Position: QUAD

Quad terminal positioning improves connection stability and signal integrity.

ROM Words: 32768

A significant amount of ROM allows for substantial program storage capability.

Width: 7 mm

The compact width enables designs with limited board space without compromising functionality.

Peripherals: BOD, POR, TIMER(5), WDT

Multiple peripheral options enhance the product's capability to manage various tasks and improve reliability.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz allows for efficient processing speeds suitable for most applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature indicates robustness during soldering processes.

Length: 7 mm

A balanced length of 7 mm further supports compact design initiatives.

Temperature Grade: INDUSTRIAL

Industrial temperature grades ensure reliable operation in rigorous conditions and longer product lifespan.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction processing, benefiting performance in embedded applications.

RAM Bytes: 4096

Ample RAM supports efficient data handling and multitasking capabilities.

Technology: CMOS

CMOS technology contributes to lower power consumption and higher density integration.

Terminal Form: NO LEAD

The no lead terminal form promotes easier and more reliable soldering processes.

Analog To Digital Converters: 8-Ch 10-Bit

8-channel, 10-bit ADCs offer adequate resolution for numerous sensor applications.

Nominal Supply Voltage: 3.3 V

The nominal voltage indicates energy efficiency and compatibility with common devices.

Connectivity: I2C, SPI(2), UART

Multiple connectivity options allow for versatile communication with various peripherals and networks.

ROM Programmability: FLASH

Flash programmability enables easy updates and modifications, allowing for flexibility in application development.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is standard for compact designs, ensuring compatibility with various assembly processes.

Moisture Sensitivity Level (MSL): 3

MSL level 3 ensures proper handling and storage conditions, maintaining reliability and performance.

Speed: 50 rpm

The product offers scalability in applications requiring precise speed control.

On Chip Program ROM Width: 8

An 8-bit wide program ROM facilitates efficient instruction processing and programming.

No. of I/O Lines: 28

With 28 I/O lines, the microcontroller supports a wide range of external devices and functionality expansions.

Technical Specifications

Microcontrollers LPC1114FHN33/203,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1114FHN33/203,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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