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LPC1114FBD48/302,1

NXP Semiconductors

LPC1114FBD48/302,1 by NXP Semiconductors

NXP Semiconductors' LPC1114FBD48/302,1 is a 32-bit microcontroller with 3.3V supply voltage, 25MHz clock frequency, and 8-Ch 10-Bit ADC channels. Ideal for industrial applications requiring a compact (7mm x 7mm) package with peripherals like BOD, POR, TIMER(5), WDT for robust performance in harsh environments.

Median Price

$6.600

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

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Element14

Singapore . 240 parts In-Stock

1+ parts

$4.480

100+ parts

$3.300

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$2.370

10k+ parts

$2.280

240

$4.480

$3.300

$2.370

$2.280

Flip Electronics (Authorized)

USA . 230 parts In-Stock

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DigiKey

USA . 138 parts In-Stock

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$6.600

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138

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Verical

USA . 138 parts In-Stock

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$7.630

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138

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$7.630

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Nova Conductors

Japan . 300 parts In-Stock

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$2.021

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$2.021

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Digiode

USA . 4,776 parts In-Stock

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$4.256

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Vyrian

USA . 5,715 parts In-Stock

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Anansix

USA . 941 parts In-Stock

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J2 Sourcing AB

Sweden . 145 parts In-Stock

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Flip Electronics

USA . 138 parts In-Stock

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138

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Rebound Electronics

UK . 50 parts In-Stock

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Distributors (Availability)

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Netroflash

USA . 1,000 parts In-Stock

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$2.021

100+ parts

$1.981

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$2.021

$1.981

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Argo Parts USA

USA . 407 parts In-Stock

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$2.021

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$2.021

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Continental Prestige Electronics

USA . 1,294 parts In-Stock

1+ parts

$2.640

100+ parts

$1.730

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$1.220

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1,294

$2.640

$1.730

$1.220

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Ampacity Inc.

Singapore . 233 parts In-Stock

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$3.810

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233

$3.810

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Semicontronic

India . 7 parts In-Stock

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$3.810

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$3.715

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$3.696

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7

$3.810

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$3.696

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Corphita

USA . 2,334 parts In-Stock

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$4.032

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$4.032

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Aztec Data Supply Inc.

USA . 2,481 parts In-Stock

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$17.900

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$17.900

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AZTECH Wire

Italy . 784 parts In-Stock

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$18.368

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Modulus Dynamics

Lithuania . 549 parts In-Stock

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$33.897

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$33.897

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$33.897

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$33.897

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Microchip USA

USA . 2,425 parts In-Stock

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$33.955

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$49.215

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$46.755

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$46.755

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Corohmni

South Africa . 657 parts In-Stock

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Lixinc

USA . 16,991 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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UNI Independent Distributors

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Perfect Parts

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iodParts Technologies Inc.

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Infinite Electronics LLP (Excess)

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S.R.D Solutions

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Unleash the power of innovation with the LPC1114FBD48/302,1 by NXP Semiconductors. As a leading manufacturer in the industry, NXP ensures top-notch quality and reliability in their microcontrollers. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers. With advanced features and cutting-edge technology, the LPC1114FBD48/302,1 provides seamless connectivity, enhanced performance, and exceptional efficiency. Elevate your projects to new heights with this innovative solution from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Easily mountable on circuit boards, making installation and assembly more efficient.

Maximum Supply Voltage: 3.6 V

Supports a higher voltage range, allowing for flexibility in power input.

Package Shape: SQUARE

Space-efficient design that can fit into compact electronic devices.

Bit Size: 32

High processing capability for handling complex tasks and calculations.

Power Supplies (V): 3.3

Common voltage supply for ease of integration with existing systems.

No. of Terminals: 48

Sufficient terminals for connecting to various components and peripherals.

Minimum Supply Voltage: 1.8 V

Supports lower voltage requirements for energy-efficient operation.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures common in industrial settings, ensuring reliability under harsh conditions.

CPU Family: CORTEX-M0

Utilizes efficient and reliable ARM Cortex-M0 architecture for optimal performance.

RAM Bytes: 8192

Sufficient memory capacity for storing program data and variables, enabling multitasking and data processing.

ADC Channels: YES

Integrated Analog to Digital Converters enable measurement of analog signals for sensor interfacing.

Connectivity: I2C, SPI(2), UART

Supports multiple communication interfaces for connecting to a variety of external devices and sensors.

Technical Specifications

Microcontrollers LPC1114FBD48/302,1 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

42

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1114FBD48/302,1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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