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LPC1113JHN33/303E

NXP Semiconductors

LPC1113JHN33/303E by NXP Semiconductors

LPC1113JHN33/303E by NXP is a 32-bit microcontroller with a max supply voltage of 3.6V and operates in -40 °C to 105 °C. It features 8 ADC channels, 28 I/O lines, and supports I2C, SPI, and UART for versatile applications in industrial automation. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$1.943

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,880 parts In-Stock

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$1.943

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$1.943

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Vyrian

USA . 7,737 parts In-Stock

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7,737

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Digiode

USA . 4,320 parts In-Stock

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4,320

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Anansix

USA . 1,573 parts In-Stock

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One Stop Electronics

USA . 864 parts In-Stock

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$2.000

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864

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AZTECH Wire

Italy . 308 parts In-Stock

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$8.770

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308

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Microchip USA

USA . 2,143 parts In-Stock

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$18.098

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Corphita

USA . 4,881 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UNI Independent Distributors

Spain . 686 parts In-Stock

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Overview

Unlock unparalleled performance and efficiency with the LPC1113JHN33/303E from NXP Semiconductors! This advanced microcontroller, boasting a 32-bit Cortex-M0 core, offers robust connectivity options and impressive reliability for various applications—from industrial automation to consumer electronics. With its low power consumption and wide temperature range, it ensures durability without compromising on speed. Trust in NXP's commitment to quality and innovation, and elevate your next project with exceptional value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robustness and reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Operating at a maximum of 3.6 V provides versatility for low-power applications, compatible with many power sources.

Package Shape: SQUARE

The square package shape makes it easier to integrate into PCB layouts and ensures better thermal performance.

Bit Size: 32

A 32-bit architecture allows for more processing power and enables handling of complex applications efficiently.

Power Supplies (V): 3.3

Running at 3.3 V is a common standard, providing compatibility with many sensors and devices.

No. of Terminals: 33

With 33 terminals, this microcontroller offers ample connectivity options for diverse peripheral attachments.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin-profile package design aids in thermal management and allows for more compact product designs.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage promotes energy efficiency, extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

A high operating temperature range makes it suitable for industrial environments where heat may be a concern.

CPU Family: CORTEX-M0

The Cortex-M0 provides a balance of performance and efficiency, suitable for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

The ability to function at low temperatures allows this microcontroller to be used in harsh environments.

ADC Channels: YES

Integrated ADC channels enable direct interfacing with analog sensors, enhancing its application range.

Terminal Position: QUAD

Quad terminal positioning allows for easy integration into PCB, saving space while simplifying soldering.

ROM Words: 24576

Significant ROM capacity allows for ample program storage, essential for sophisticated applications.

Width: 7 mm

A compact width makes this microcontroller suitable for tight spaces in miniaturized devices.

Peripherals: BOD, POR, TIMER(5), WDT

The inclusion of various peripherals enhances functionality, enabling diverse use cases in embedded systems.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz offers decent performance for real-time applications.

Peak Reflow Temperature °C: 260

High reflow temperature capability indicates robustness in manufacturing processes and ensures quality.

Length: 7 mm

The short length complements the width, maintaining a compact footprint for small form factor designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability under extreme conditions, suitable for industrial automation.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture allows for efficient instruction processing, enhancing performance in low-power applications.

RAM Bytes: 8192

Ample RAM capacity supports complex algorithms and data processing tasks in embedded applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: NO LEAD

No lead design reduces overall dimensions and can improve signal integrity, making it ideal for modern designs.

Analog To Digital Converters: 8-Ch 10-Bit

With 8 channels of 10-bit ADCs, this microcontroller can easily interface with multiple sensors simultaneously.

Nominal Supply Voltage: 3.3 V

Nominal voltage of 3.3 V ensures consistent operation and compatibility with a wide range of devices.

Connectivity: I2C, SPI(2), UART

Multiple connectivity options provide flexibility for interfacing with various peripherals and components.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, enhancing adaptability.

Terminal Pitch: 0.65 mm

A smaller terminal pitch enables denser layouts on PCBs, making this microcontroller suitable for compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating helps ensure safe handling and product longevity in various environments.

Speed: 50 rpm

The speed capability allows for integration in applications requiring specific timing and control outputs.

On Chip Program ROM Width: 8

An 8-bit ROM width maximizes compatibility with a wide range of programming standards and applications.

No. of I/O Lines: 28

28 I/O lines provide extensive options for interfacing with additional components and sensors.

Technical Specifications

Microcontrollers LPC1113JHN33/303E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

24576

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1113JHN33/303E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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