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LPC1113FHN33/302K

NXP Semiconductors

LPC1113FHN33/302K by NXP Semiconductors

LPC1113FHN33/302K by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 8 ADC channels, and operates in -40 °C to 85 °C range. Ideal for industrial applications, it supports I2C, SPI, and UART connectivity with a compact design. Its efficient performance makes it suitable for embedded systems.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 3,626 parts In-Stock

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Anansix

USA . 2,265 parts In-Stock

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Digiode

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Microchip USA

USA . 3,805 parts In-Stock

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$14.456

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One Stop Electronics

USA . 209 parts In-Stock

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AZTECH Wire

Italy . 656 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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UNI Independent Distributors

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Corphita

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Authorized Procurement Solutions

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Overview

Unlock the potential of your projects with the LPC1113FHN33/302K from NXP Semiconductors, a trusted leader in microcontroller innovation. This versatile 32-bit Cortex-M0 chip offers exceptional power efficiency and robust performance, suitable for a range of applications from consumer electronics to industrial automation. With its compact design and reliable durability, it ensures seamless integration and enhanced functionality, empowering you to bring your ideas to life effortlessly. Choose quality, choose NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and protection against environmental factors, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and better performance in high-density circuits, ideal for modern electronic devices.

Maximum Supply Voltage: 3.6 V

This maximum supply voltage allows for flexibility in power supply options, accommodating many low-power applications.

Package Shape: SQUARE

The square package shape contributes to uniform thermal distribution and easier integration into circuit boards.

Bit Size: 32

A 32-bit architecture allows for more complex computations and better performance in processing tasks, suitable for a wide range of applications.

Power Supplies (V): 3.3

Operating at 3.3V is common in low-power electronics, optimizing energy consumption while maintaining functionality.

No. of Terminals: 33

With 33 terminals, this microcontroller provides ample ports for connectivity and flexibility in circuit design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style promotes efficient heat dissipation, enabling use in spaces where thermal management is critical.

Minimum Supply Voltage: 1.8 V

The ability to operate down to 1.8V increases its compatibility with various battery-powered applications, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments, this high-temperature tolerance ensures reliable operation in demanding conditions.

CPU Family: CORTEX-M0

Based on the efficient Cortex-M0 architecture, this microcontroller offers excellent performance in low-power scenarios.

Minimum Operating Temperature: -40 °C

The ability to function in low temperatures makes it ideal for outdoor and harsh environment applications.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, increasing the versatility of the microcontroller for various input types.

Terminal Position: QUAD

The quad terminal position allows for easier integration and soldering onto PCBs, saving assembly time and costs.

ROM Words: 24576

A substantial ROM capacity provides ample storage for application code, enhancing functional capabilities.

Width: 7 mm

The compact width allows for space-saving designs in small electronic devices without compromising performance.

Peripherals: BOD, POR, TIMER(5), WDT

The inclusion of multiple peripherals adds features such as power management and timing functions, making it a comprehensive solution for diverse applications.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz allows for adequate processing speed, facilitating efficient execution of tasks.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures, this microcontroller can be reliably used in surface mount technology applications.

Length: 7 mm

A length of 7 mm contributes to the overall compact footprint, enabling integration into space-constrained devices.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this microcontroller is reliable in critical applications where environmental conditions can fluctuate.

Peripheral IC Type: MICROCONTROLLER, RISC

This RISC architecture facilitates efficient instruction processing, ensuring better overall performance in executing tasks.

RAM Bytes: 8192

With 8192 bytes of RAM, it provides enough memory for efficient data processing and manipulation, making it suitable for complex applications.

Technology: CMOS

Using CMOS technology enhances power efficiency and performance, which is essential for battery-operated devices.

Terminal Form: NO LEAD

The no-lead package form allows for reduced footprint and improved emissions performance, leading to better thermal characteristics and reliability.

Analog To Digital Converters: 8-Ch 10-Bit

The presence of 8-channel, 10-bit ADCs enables precise analog measurements, enhancing the microcontroller’s capability in sensor applications.

Nominal Supply Voltage: 3.3 V

The nominal operating voltage of 3.3V ensures compatibility with many modern components in low-power systems.

Connectivity: I2C, SPI, UART

Multiple connectivity options provide versatility in interfacing with various devices and components, enhancing integration capabilities.

ROM Programmability: FLASH

With flash ROM programmability, users can easily update firmware, affording flexibility in application development and deployment.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for denser PCB layouts, facilitating advanced circuit designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates reasonable handling procedures, ensuring reliability in a variety of environments.

Speed: 50 rpm

Operating speed of 50 rpm offers satisfactory performance for control applications, enhancing practical usability.

On Chip Program ROM Width: 8

8-bit program ROM width optimizes memory access and instruction processing, contributing to improved performance.

No. of I/O Lines: 28

With 28 I/O lines, this microcontroller provides extensive options for external interfacing, making it versatile for various projects.

Technical Specifications

Microcontrollers LPC1113FHN33/302K attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

24576

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1113FHN33/302K Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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