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LPC1113FHN33/301,5

NXP Semiconductors

LPC1113FHN33/301,5 by NXP Semiconductors

LPC1113FHN33/301,5 by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V and an operating temp range from -40 °C to 85 °C. It offers 8 ADC channels and supports I2C, SPI, and UART for versatile applications in industrial automation. With 8KB RAM and 24KB ROM, it's ideal for embedded systems.

Median Price

$3.818

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 259 parts In-Stock

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$5.570

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$3.140

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$2.450

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259

$5.570

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$2.450

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Verical

USA . 9,880 parts In-Stock

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$2.067

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$2.067

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Distributors (In-Stock)

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Digiode

USA . 4,435 parts In-Stock

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$4.218

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Flip Electronics

USA . 17,680 parts In-Stock

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17,680

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Vyrian

USA . 10,541 parts In-Stock

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R&J Components

USA . 518 parts In-Stock

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518

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Anansix

USA . 145 parts In-Stock

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145

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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100

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Fibra_Brandt Electronic GMBH

Germany . 20 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 621 parts In-Stock

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$3.996

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621

$3.996

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Advanced Electronics

New Zealand . 15 parts In-Stock

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$19.196

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$17.468

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$15.741

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15

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$15.741

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Microchip USA

USA . 7,534 parts In-Stock

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Authorized Procurement Solutions

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UNI Independent Distributors

Spain . 3,267 parts In-Stock

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Perfect Parts

USA . 1,165 parts In-Stock

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Overview

Unlock the potential of your next project with the LPC1113FHN33/301,5 microcontroller from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP provides a reliable solution that boasts low power consumption and versatile connectivity options. Ideal for industrial applications, this compact chip ensures efficient performance in diverse environments, empowering developers to create cutting-edge solutions with ease and confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and lightweight properties, making it suitable for compact electronic applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and is beneficial for automated assembly processes.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with common low-voltage electronic components.

Package Shape: SQUARE

The square package shape provides uniformity and simplifies PCB layout designs.

Bit Size: 32

With a 32-bit architecture, the microcontroller offers higher processing power and efficiency for complex applications.

Power Supplies (V): 3.3

A nominal power supply of 3.3 V is standard in many low-power embedded systems, ensuring broad compatibility.

No. of Terminals: 33

Having 33 terminals allows for multiple I/O connections, enhancing the microcontroller's versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style contributes to heat dissipation and space efficiency, making it ideal for performance-sensitive applications.

Minimum Supply Voltage: 1.8 V

The minimum supply voltage of 1.8 V allows for use in ultra-low-power designs and extends battery life.

Maximum Operating Temperature: 85 °C

Rated for a maximum temperature of 85 °C, this microcontroller can operate in a range of environmental conditions.

CPU Family: CORTEX-M0

The ARM Cortex-M0 core offers efficient processing with low power consumption, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C makes this microcontroller suitable for use in extreme environments.

ADC Channels: YES

Incorporating ADC channels allows for the microcontroller to interface with analog sensors, broadening application possibilities.

Terminal Position: QUAD

Quad terminal positioning enhances signal integrity and eases PCB routing.

ROM Words: 24576

A ROM capacity of 24576 words provides ample space for firmware and application code.

Width: 7 mm

The compact 7 mm width is space-efficient, making it suitable for miniaturized electronic designs.

Peripherals: BOD, POR, TIMER(5), WDT

Built-in peripherals enhance functionality and integration, reducing the need for additional components.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz enables efficient processing of tasks, suitable for real-time applications.

Peak Reflow Temperature °C: 260

Withstand peak reflow temperatures of 260 °C ensures the microcontroller's reliability during soldering processes.

Length: 7 mm

Coupled with its width, the 7 mm length contributes to a very compact form factor ideal for space-constrained designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade translates to higher reliability and performance consistency in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller promotes efficient instruction processing and power efficiency.

RAM Bytes: 8192

With 8192 bytes of RAM, it supports complex applications and multitasking with ease.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: NO LEAD

No lead terminal design contributes to better solderability and reduces environmental impact.

Analog To Digital Converters: 8-Ch 10-Bit

The presence of 8-channel 10-bit ADCs allows for flexible analog input options and enhanced sensor interfacing.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V optimizes power usage, particularly in battery-powered applications.

Connectivity: I2C, SPI, UART

Multiple connectivity options like I2C, SPI, and UART enable easy integration with various devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability ensures ease of firmware updates and quick application development.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high density in PCB layout, which is advantageous in miniaturized designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, necessitating standard handling practices for reliability.

Speed: 50 rpm

Operational speed of 50 rpm indicates suitability for low-speed control tasks, accommodating a variety of applications.

On Chip Program ROM Width: 8

With an 8-bit ROM width, the microcontroller can efficiently manage smaller data instructions.

No. of I/O Lines: 28

28 I/O lines provide ample interfacing capacity for multiple devices and sensors, enhancing flexibility.

Technical Specifications

Microcontrollers LPC1113FHN33/301,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

24576

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1113FHN33/301,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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