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LPC1113FHN33/203,5

NXP Semiconductors

LPC1113FHN33/203,5 by NXP Semiconductors

LPC1113FHN33/203,5 by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V and operates in -40 °C to 85 °C range. It includes 8 ADC channels and supports I2C, SPI, and UART for versatile applications in industrial automation. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$1.880

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.775

10k+ parts

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9,880

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-

$1.775

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Rochester

USA . 275 parts In-Stock

1+ parts

-

100+ parts

$1.880

1k+ parts

$1.680

10k+ parts

$1.580

275

-

$1.880

$1.680

$1.580

DigiKey

USA . 275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.250

10k+ parts

-

275

-

-

$2.250

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,167 parts In-Stock

1+ parts

$1.644

100+ parts

-

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4,167

$1.644

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Vyrian

USA . 10,601 parts In-Stock

1+ parts

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1k+ parts

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10,601

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Anansix

USA . 2,262 parts In-Stock

1+ parts

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2,262

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,914 parts In-Stock

1+ parts

$1.557

100+ parts

-

1k+ parts

-

10k+ parts

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1,914

$1.557

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Component Stockers USA

USA . 241 parts In-Stock

1+ parts

$2.500

100+ parts

$2.350

1k+ parts

-

10k+ parts

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241

$2.500

$2.350

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QUARKTWIN TECHNOLOGY LTD

USA . 16,612 parts In-Stock

1+ parts

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16,612

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Microchip USA

USA . 10,646 parts In-Stock

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10,646

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UNI Independent Distributors

Spain . 1,798 parts In-Stock

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1,798

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Overview

Elevate your projects with the LPC1113FHN33/203.5 microcontroller from NXP Semiconductors, renowned for unyielding quality and reliability. This powerful 32-bit device delivers exceptional performance with low power consumption, ideal for a range of applications including industrial automation, IoT devices, and consumer electronics. Experience seamless connectivity options and robust features that ensure your designs excel while benefiting from NXP’s industry-leading innovation and support.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure longevity and reliability in various applications.

Surface Mount: YES

Surface mount design allows for compact and efficient PCB layouts, enhancing design flexibility.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage that is compatible with a wide range of power sources, ensuring easy integration.

Package Shape: SQUARE

Square package shape optimizes layout space on PCBs, facilitating dense designs.

Bit Size: 32

32-bit architecture enables efficient processing and larger addressable memory space compared to 8-bit or 16-bit microcontrollers.

Power Supplies (V): 3.3

Standard voltage supply allows compatibility with various electronic components and reduces power consumption.

No. of Terminals: 33

A greater number of terminals facilitates more I/O options, promoting greater versatility in application development.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Thin profile design enhances space-saving opportunities in compact electronics.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage extends battery life and makes it suitable for low-power applications.

Maximum Operating Temperature: 85 °C

Suitable for operation in demanding industrial environments, ensuring reliable performance under high temperatures.

CPU Family: CORTEX-M0

Based on the efficient ARM Cortex-M0 architecture, offering low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliability in extreme environments, making it ideal for industrial applications.

ADC Channels: YES

Integration of ADC capabilities allows for direct interfacing with analog sensors, enhancing functionality.

Terminal Position: QUAD

Quad terminal positioning simplifies layout and improves soldering reliability.

ROM Words: 24576

Sufficient ROM provides ample storage for code, allowing complex applications to be implemented.

Width: 7 mm

Compact width is advantageous for space-constrained designs.

Peripherals: BOD, POR, TIMER(5), WDT

Inclusion of essential peripherals enhances functionality and supports robust system management.

Maximum Clock Frequency: 25 MHz

Decent clock frequency supports responsive applications and efficient processing capabilities.

Peak Reflow Temperature: 260 °C

High reflow temperature compatibility ensures durability during manufacturing processes.

Length: 7 mm

Compact length optimizes board space and reduces footprint.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring durability and reliability in various environment conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance and power efficiency, making it ideal for embedded systems.

RAM Bytes: 4096

Adequate RAM size allows for efficient data handling and processing in applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for battery-operated devices.

Terminal Form: NO LEAD

No-lead design helps reduce the overall environmental impact and enhances solderability.

Analog To Digital Converters: 8-Ch 10-Bit

Multiple ADC channels enable effective interaction with various sensors, expanding the application range.

Nominal Supply Voltage: 3.3 V

A standard voltage level reduces design complexity as it aligns with common electronic components.

Connectivity: I2C, SPI(2), UART

Flexible connectivity options allow seamless integration with a variety of peripherals and communication protocols.

ROM Programmability: FLASH

Flash programmability enables easy updates and reprogramming, enhancing long-term usability.

Terminal Pitch: 0.65 mm

Compact terminal pitch allows for more terminals in a smaller space, improving design capabilities.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level indicating reasonable precautions for handling during assembly.

Speed: 50 rpm

Adequate speed for many applications, combining performance with efficiency.

On Chip Program ROM Width: 8

8-bit program ROM width supports efficient data handling in varying application contexts.

No. of I/O Lines: 28

A generous number of I/O lines provides flexibility in interfacing with other components and peripherals.

Technical Specifications

Microcontrollers LPC1113FHN33/203,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

24576

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1113FHN33/203,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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