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LPC1112JHN33/103E

NXP Semiconductors

LPC1112JHN33/103E by NXP Semiconductors

LPC1112JHN33/103E by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 25 MHz clock speed, and industrial temp range (-40 °C to 105 °C). It supports I2C, SPI, and UART for versatile connectivity. Ideal for embedded applications requiring efficient processing and low power consumption.

Median Price

$1.660

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 3,640 parts In-Stock

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Rochester

USA . 260 parts In-Stock

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$1.570

1k+ parts

$1.400

10k+ parts

$1.320

260

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$1.570

$1.400

$1.320

Verical

USA . 260 parts In-Stock

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$1.750

10k+ parts

$1.650

260

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$1.750

$1.650

Distributors (In-Stock)

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Digiode

USA . 946 parts In-Stock

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$3.334

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946

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Vyrian

USA . 8,136 parts In-Stock

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Flip Electronics

USA . 7,280 parts In-Stock

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Anansix

USA . 275 parts In-Stock

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275

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,560 parts In-Stock

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$2.980

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Corphita

USA . 2,611 parts In-Stock

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$3.159

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Microchip USA

USA . 2,601 parts In-Stock

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$15.169

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UNI Independent Distributors

Spain . 6,129 parts In-Stock

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Overview

Unlock your project’s potential with the LPC1112JHN33/103E from NXP Semiconductors, a trusted leader in microcontroller innovation. Designed for efficiency and versatility, this compact 32-bit MCU excels in industrial applications, offering reliable performance even in extreme temperatures. With integrated ADC channels and multiple connectivity options, it simplifies complex designs while ensuring optimal power management. Elevate your development with unmatched quality and support from a pioneer in semiconductor technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronics, saving space on PCBs.

Maximum Supply Voltage: 3.6 V

Operating at a maximum of 3.6 V allows compatibility with a wide range of power supplies, enhancing flexibility in system design.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, facilitating dense circuit designs.

Bit Size: 32

A 32-bit architecture enables the handling of larger data types and more complex calculations, making it suitable for advanced applications.

Power Supplies (V): 3.3

Operating at 3.3 V is common in many low-power devices, aiding in energy efficiency and extending battery life.

No. of Terminals: 33

With 33 terminals, this microcontroller offers ample connectivity options for peripheral devices, enhancing its versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style helps with thermal dissipation and allows for compact designs, making it fit for various applications.

Minimum Supply Voltage: 1.8 V

Operating down to 1.8 V increases compatibility with low-power applications, which is essential for battery-operated devices.

Maximum Operating Temperature: 105 °C

A high operating temperature rating means that this microcontroller can function well in industrial and challenging environments.

CPU Family: CORTEX-M0

The Cortex-M0 family provides a balance of performance and energy efficiency, making it ideal for low-power embedded applications.

Minimum Operating Temperature: -40 °C

With a low minimum temperature rating, this microcontroller is suitable for use in extreme environmental conditions.

ADC Channels: YES

The presence of ADC channels allows for the conversion of analog signals, broadening the range of applications.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and robust electrical connections, essential for reliable performance.

ROM Words: 16384

A ROM size of 16384 words provides sufficient memory for storing programs, making it suitable for complex applications.

Width: 7 mm

The compact width of 7 mm supports high-density designs in limited spaces, perfect for modern electronic devices.

Peripherals: BOD, POR, TIMER(5), WDT

Various built-in peripherals enhance the functionality of the microcontroller, allowing for robust design and control.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz supports efficient processing and execution of tasks for real-time applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures compatibility with standard soldering processes, facilitating manufacturing.

Length: 7 mm

The length of 7 mm complements the compact design, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in demanding environments, making it ideal for automotive and industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller offers higher efficiency and speed, crucial for performance-critical applications.

RAM Bytes: 2048

With 2048 bytes of RAM, it can handle data manipulation and processing efficiently for most embedded tasks.

Technology: CMOS

CMOS technology provides low power consumption, enhancing battery life which is vital for portable devices.

Terminal Form: NO LEAD

The no-lead form factor minimizes the footprint and contributes to better thermal and electrical performance.

Analog To Digital Converters: 8-Ch 10-Bit

The 8-channel 10-bit ADCs allow for multiple sensor inputs, facilitating versatile data acquisition capabilities.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is compatible with many modern electronics, enhancing design flexibility.

Connectivity: I2C, SPI(2), UART

Multiple connectivity options like I2C, SPI, and UART improve integration with other devices and modems, facilitating communication.

ROM Programmability: FLASH

Flash programmability allows for easy updates and changes to the program, enhancing the product's longevity and adaptability.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for a compact layout on PCBs, making it ideal for high-density applications.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate sensitivity, guiding proper handling and storage for effective performance.

Speed: 50 rpm

The specified speed is suitable for applications requiring low-speed operation, making it ideal for various industrial controls.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports efficient execution of instructions while maintaining program simplicity.

No. of I/O Lines: 28

With 28 I/O lines, this microcontroller can connect to numerous external devices, providing flexibility for various projects.

Technical Specifications

Microcontrollers LPC1112JHN33/103E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1112JHN33/103E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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