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LPC1111JHN33/103E

NXP Semiconductors

LPC1111JHN33/103E by NXP Semiconductors

LPC1111JHN33/103E by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 25 MHz clock speed, and 8-channel ADC. It operates in extreme temps (-40 °C to 105 °C) and supports I2C, SPI, and UART for versatile applications in industrial settings.

Median Price

$1.370

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 3,640 parts In-Stock

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Rochester

USA . 60 parts In-Stock

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$1.370

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$1.220

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$1.150

60

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$1.370

$1.220

$1.150

Distributors (In-Stock)

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Digiode

USA . 4,485 parts In-Stock

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$1.311

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Flip Electronics

USA . 7,280 parts In-Stock

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7,280

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Vyrian

USA . 2,336 parts In-Stock

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Anansix

USA . 951 parts In-Stock

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951

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Distributors (Availability)

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Corphita

USA . 4,437 parts In-Stock

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$1.242

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Component Stockers USA

USA . 83 parts In-Stock

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$1.560

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Microchip USA

USA . 2,070 parts In-Stock

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$14.436

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AZTECH Wire

Italy . 1,062 parts In-Stock

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$16.280

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UNI Independent Distributors

Spain . 4,397 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Overview

Unlock limitless possibilities with the LPC1111JHN33/103E microcontroller from NXP Semiconductors. Renowned for exceptional quality and reliability, this compact powerhouse excels in low-power applications, making it ideal for IoT devices, automation systems, and wearables. With robust connectivity options and superior temperature tolerance, it offers unmatched performance for demanding environments, empowering you to innovate and elevate your projects effortlessly. Experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient use of PCB space, ideal for modern electronic devices.

Maximum Supply Voltage: 3.6 V

The moderate maximum supply voltage enhances compatibility with various power sources commonly used in low-power applications.

Package Shape: SQUARE

The square package shape optimizes the layout for efficient thermal management and space utilization on PCBs.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and processes efficiently, making it suitable for advanced applications.

Power Supplies (V): 3.3

The 3.3V power supply is standard for many digital systems, ensuring compatibility with a wide range of components.

No. of Terminals: 33

A higher number of terminals facilitates greater connectivity options, allowing the integration of multiple interfaces and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile aids in space-constrained applications while the heat sink feature helps in managing thermal performance.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for battery-powered applications and improves energy efficiency.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature extends the operational range, making it suitable for industrial and harsh environments.

CPU Family: CORTEX-M0

The ARM Cortex-M0 architecture offers a balance of performance and power efficiency, making it ideal for embedded systems.

Minimum Operating Temperature: -40 °C

The extended minimum operating temperature enables functionality in extremely cold environments, broadening application potential.

ADC Channels: YES

Integrated ADC channels enhance analog signal processing, making it suitable for applications requiring real-world signal interfacing.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing and improved signal integrity on the PCB.

ROM Words: 8192

With 8192 ROM words, there is sufficient memory for firmware storage, enabling complex functionalities in embedded applications.

Width: 7 mm

The compact width makes it ideal for space-constrained designs in portable or small electronic devices.

Peripherals: BOD, POR, TIMER(5), WDT

A rich set of peripherals enhances the microcontroller's functionality and enables various control and monitoring applications.

Maximum Clock Frequency: 25 MHz

A 25 MHz clock frequency allows for relatively fast processing speeds, suitable for real-time applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature rating supports compatibility with common soldering processes in PCB assembly.

Length: 7 mm

The 7 mm length complements its width, making it a compact package that fits in tight spaces.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this microcontroller can operate reliably under demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture typically provides higher performance with lower instruction counts, making the microcontroller efficient.

RAM Bytes: 2048

2048 bytes of RAM provide sufficient memory for data handling during processing, crucial for embedded applications.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, making it suitable for battery-powered applications.

Terminal Form: NO LEAD

No lead design minimizes environmental impacts and is advantageous in automated assembly processes.

Analog To Digital Converters: 8-Ch 10-Bit

The 8-channel, 10-bit ADC's enable multiple analog inputs to be read, making it versatile for sensor-based applications.

Nominal Supply Voltage: 3.3 V

The nominal voltage aligns with standard logic levels, enhancing compatibility with other components and systems.

Connectivity: I2C, SPI(2), UART

Diverse connectivity options make it easy to interface with various devices and peripherals, increasing versatility in design.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and reprogramming, which is essential for modern applications.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch fits well with high-density PCBs, ensuring efficient layout and routing.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates the microcontroller has moderate sensitivity to moisture, suitable for a variety of environments.

Speed: 50 rpm

A speed rating of 50 rpm, while specific, indicates suitability for applications involving slow rotational elements.

On Chip Program ROM Width: 8

An 8-bit ROM width indicates compatibility with a variety of software designs, making it a versatile choice for developers.

No. of I/O Lines: 28

With 28 I/O lines, the microcontroller can handle numerous inputs and outputs, making it suitable for complex applications.

Technical Specifications

Microcontrollers LPC1111JHN33/103E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1111JHN33/103E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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