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LPC1111FHN33/203,5

NXP Semiconductors

LPC1111FHN33/203,5 by NXP Semiconductors

LPC1111FHN33/203,5 by NXP is a 32-bit microcontroller featuring a max supply voltage of 3.6V and operates in temperatures from -40 °C to 85 °C. It includes 8 ADC channels and supports I2C, SPI, and UART for versatile applications. Ideal for industrial automation and embedded systems.

Median Price

$2.326

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 260 parts In-Stock

1+ parts

$3.070

100+ parts

$1.890

1k+ parts

$1.724

10k+ parts

$1.590

260

$3.070

$1.890

$1.724

$1.590

Flip Electronics (Authorized)

USA . 6,240 parts In-Stock

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6,240

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Verical

USA . 6,240 parts In-Stock

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$1.582

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6,240

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$1.582

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Distributors (In-Stock)

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Digiode

USA . 1,133 parts In-Stock

1+ parts

$2.556

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1,133

$2.556

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Flip Electronics

USA . 6,240 parts In-Stock

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6,240

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Vyrian

USA . 2,886 parts In-Stock

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2,886

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Anansix

USA . 2,510 parts In-Stock

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Classic Components Corporation

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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Corphita

USA . 303 parts In-Stock

1+ parts

$2.421

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303

$2.421

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QUARKTWIN TECHNOLOGY LTD

USA . 20,012 parts In-Stock

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Microchip USA

USA . 11,057 parts In-Stock

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UNI Independent Distributors

Spain . 232 parts In-Stock

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Overview

Elevate your projects with the LPC1111FHN33/203,5 microcontroller from NXP Semiconductors, a name synonymous with reliability and innovation. This versatile 32-bit MCU brings exceptional performance in compact designs, perfect for industrial applications and smart devices alike. With low power consumption and robust features, it simplifies connectivity while ensuring durability in demanding environments. Trust in NXP's quality to drive your next breakthrough!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction enhances reliability and provides resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic devices.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage ensures compatibility with a wide range of power supplies while maintaining energy efficiency.

Package Shape: SQUARE

A square package shape allows for efficient space utilization on printed circuit boards (PCBs).

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and larger data sets effectively.

Power Supplies (V): 3.3

The nominal power supply of 3.3 V is common in digital systems, simplifying design and power management.

No. of Terminals: 33

Having 33 terminals provides a sufficient number of connections for various peripherals and I/O configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile and heat sink compatibility improve thermal performance and fit into compact designs.

Minimum Supply Voltage: 1.8 V

This wide voltage range (1.8 V - 3.6 V) offers flexibility in power supply options and enhances operational capability.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in demanding environments and industrial applications.

CPU Family: CORTEX-M0

Cortex-M0 provides a cost-effective solution with a balance of performance and power efficiency, ideal for low-power applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes it suitable for harsh environments.

ADC Channels: YES

Inclusion of ADC channels allows for direct interfacing with analog sensors, enhancing application versatility.

Terminal Position: QUAD

The quad terminal configuration improves PCB layout efficiency and simplifies routing.

ROM Words: 8192

With 8192 ROM words, the microcontroller has ample memory for storing code and applications.

Width: 7 mm

A compact width of 7 mm allows for integration into space-constrained designs.

Peripherals: BOD, POR, TIMER(5), WDT

Multiple peripherals provide essential functionalities like power management and timing, enhancing application capabilities.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz enables efficient processing for a variety of tasks and applications.

Peak Reflow Temperature °C: 260

Handling a peak reflow temperature of 260 °C ensures compatibility with modern soldering processes.

Length: 7 mm

A length of 7 mm complements its width for compact and efficient electronic design.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature applications, making it suitable for use in a range of demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it benefits from a reduced instruction set for improved performance and efficiency.

RAM Bytes: 4096

With 4096 bytes of RAM, it provides sufficient volatile storage for executing tasks and data processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall system performance.

Terminal Form: NO LEAD

The no lead design minimizes space usage on PCBs and simplifies manufacturing.

Analog To Digital Converters: 8-Ch 10-Bit

An 8-channel, 10-bit ADC enables accurate sampling of a variety of signals for enhanced data acquisition.

Nominal Supply Voltage: 3.3 V

The nominal voltage is compatible with many modern sensors and interfaces, facilitating system integration.

Connectivity: I2C, SPI(2), UART

Multiple communication options like I2C, SPI, and UART provide flexibility for interfacing with other devices.

ROM Programmability: FLASH

Flash ROM allows for easy updates and program changes, providing a dynamic solution for evolving applications.

Terminal Pitch: 0.65 mm

The 0.65 mm pitch enables high-density PCB layouts, which are increasingly necessary for modern electronic designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates that proper handling and storage are required, ensuring longevity and reliability of the device.

Speed: 50 rpm

The speed rating indicates suitability for low-speed applications, enhancing its applicability.

On Chip Program ROM Width: 8

The 8-bit program ROM width optimizes memory usage while providing capability for various applications.

No. of I/O Lines: 28

Having 28 I/O lines ensures sufficient connectivity for diverse interfacing options in various applications.

Technical Specifications

Microcontrollers LPC1111FHN33/203,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

33

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

8192

ROM Programmability:

FLASH

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(2), UART

Peripherals:

BOD, POR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LPC1111FHN33/203,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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