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I74F656AD

NXP Semiconductors

I74F656AD by NXP Semiconductors

I74F656AD by NXP Semiconductors is an 8-bit bus driver with a propagation delay of just 9 ns, operating at a nominal voltage of 5V. It features dual ports and supports industrial applications with a max temp of 85 °C. Ideal for efficient data transmission in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,801 parts In-Stock

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Vyrian

USA . 3,628 parts In-Stock

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3,628

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Anansix

USA . 1,102 parts In-Stock

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1,102

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 5 parts In-Stock

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5

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Andel Nordic

Denmark . 225 parts In-Stock

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$1.070

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$1.027

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$1.027

225

$1.070

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$1.027

$1.027

One Stop Electronics

USA . 1,486 parts In-Stock

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$13.000

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UNI Independent Distributors

Spain . 5,929 parts In-Stock

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Assy Fe

Spain . 2,930 parts In-Stock

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Corphita

USA . 2,526 parts In-Stock

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Overview

Elevate your designs with the I74F656AD from NXP Semiconductors—a robust bus driver and transceiver that seamlessly combines quality and performance. Engineered for versatility, this 8-bit device excels in a range of applications from industrial automation to consumer electronics. With a sleek surface mount design and superior reliability, it ensures optimal signal integrity and efficiency. Experience the unmatched support of a leading manufacturer dedicated to innovation, giving you the edge in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robustness and reliability in various environmental conditions.

Propagation Delay At Nominal Supply: 18 ns

This low propagation delay provides fast signal transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology saves PCB space and allows for automated manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape is optimized for efficient layout on PCBs and enhances ease of handling.

No. of Bits: 8

An 8-bit data bus allows for efficient data transfer, making it ideal for microcontroller and digital signal processing applications.

Nominal Supply Voltage / Vsup (V): 5

The common 5 V supply voltage makes it compatible with numerous systems and devices.

Load Capacitance (CL): 50 pF

Low load capacitance ensures minimal signal degradation, enhancing overall performance.

Power Supplies (V): 5

The reliable power supply parameter ensures consistent performance in varied applications.

No. of Terminals: 24

A 24-terminal capacity permits a versatile connection configuration, accommodating diverse systems.

Package Style (Meter): SMALL OUTLINE

The small outline package enables space-saving designs and is suitable for portable applications.

Maximum I (ol): 64 Amp

A high output current capability allows for driving loads effectively without risk of damage.

Propagation Delay (tpd): 9 ns

A very low propagation delay enhances timing performance, crucial for high-speed digital communication.

Maximum Operating Temperature: 85 °C

The ability to operate at higher temperatures ensures reliability in demanding industrial environments.

Output Characteristics: 3-STATE

3-state output allows for multiple devices on the same bus, reducing the need for additional external components.

Minimum Operating Temperature: -40 °C

This wide operating temperature range makes it suitable for use in extreme environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finishes improve solderability and provide better corrosion resistance.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in PCB layout and assembly.

No. of Ports: 2

Two ports facilitate bi-directional communication, ideal for multi-device interconnection.

Maximum Seated Height: 2.65 mm

A low seated height aids in compact designs where height restrictions are a concern.

Width: 7.5 mm

A narrower width allows for tighter spacing on PCB layouts, enhancing design efficiency.

Output Polarity: TRUE

True output polarity is advantageous for systems requiring specific logical behavior.

Minimum Supply Voltage (Vsup): 4.5 V

The ability to operate at a lower voltage improves compatibility with battery-operated systems.

Maximum Time At Peak Reflow Temperature (s): 30

Supporting longer reflow times ensures successful soldering processes during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for compatibility with various soldering processes.

Length: 15.4 mm

Short length contributes to compact solutions, essential in modern device designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliable operation in tough conditions, enhancing product longevity.

Technology: TTL

Transistor-Transistor Logic technology provides fast switching speeds and increased reliability.

Terminal Form: GULL WING

The gull wing terminal form is widely compatible with automated assembly processes, ensuring efficient manufacturing.

Terminal Pitch: 1.27 mm

Standard terminal pitch facilitates easy integration with existing designs and components.

Control Type: ENABLE LOW

Low enable threshold improves noise immunity, ensuring stable operation in noisy environments.

Maximum Supply Voltage (Vsup): 5.5 V

A flexible maximum supply voltage accommodates a range of applications without compromise.

Maximum Power Supply Current (ICC): 110 mA

The moderate current draw ensures efficient power usage, making it suitable for energy-sensitive applications.

Technical Specifications

Bus Driver & Transceivers I74F656AD attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH TRIPLE OUTPUT ENABLE; ODD/EVEN PARITY GENERATION WITH TRISTATE OUTPUTS

Control Type:

ENABLE LOW

Family:

F/FAST

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

110 mA

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

I74F656AD Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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