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I74F652AN

NXP Semiconductors

I74F652AN by NXP Semiconductors

REGISTERED BUS TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,384 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,384

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-

-

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Anansix

USA . 2,034 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,034

-

-

-

-

Digiode

USA . 307 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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307

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-

-

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Resion

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5

-

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 171 parts In-Stock

1+ parts

$1.840

100+ parts

-

1k+ parts

$1.286

10k+ parts

$1.286

171

$1.840

-

$1.286

$1.286

One Stop Electronics

USA . 807 parts In-Stock

1+ parts

$17.000

100+ parts

-

1k+ parts

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10k+ parts

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807

$17.000

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-

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Corphita

USA . 3,487 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,487

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UNI Independent Distributors

Spain . 2,949 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,949

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Technical Specifications

Bus Driver & Transceivers I74F652AN attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

SELECT INPUT FOR MULTIPLEXED TRANSMISSION OF REGISTERED/REAL TIME DATA

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

F/FAST

JESD-30 Code:

R-PDIP-T24

Length:

31.7 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

48 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

165 mA

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

I74F652AN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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