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I74F244D

NXP Semiconductors

I74F244D by NXP Semiconductors

I74F244D by NXP Semiconductors is a 4-bit bus driver with a propagation delay of just 7 ns, ideal for high-speed applications. It operates at a nominal voltage of 5V and features dual ports with 3-state output characteristics. This device is suitable for industrial use, supporting temperatures from -40 °C to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,185 parts In-Stock

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2,185

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Digiode

USA . 1,731 parts In-Stock

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1,731

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Anansix

USA . 1,553 parts In-Stock

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1,553

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Distributors (Availability)

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Andel Nordic

Denmark . 500 parts In-Stock

1+ parts

$7.099

100+ parts

-

1k+ parts

$6.815

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$6.815

500

$7.099

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$6.815

$6.815

One Stop Electronics

USA . 673 parts In-Stock

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$44.000

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673

$44.000

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UNI Independent Distributors

Spain . 4,376 parts In-Stock

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Assy Fe

Spain . 4,177 parts In-Stock

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4,177

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Corphita

USA . 260 parts In-Stock

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260

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Overview

Elevate your designs with the I74F244D from NXP Semiconductors, a pinnacle of reliability in bus drivers and transceivers. Crafted from high-quality materials, this advanced component ensures swift data transmission and seamless integration into your projects. With versatile applications in industrial automation and consumer electronics, it offers exceptional performance for demanding environments. Choose I74F244D for unmatched value, efficiency, and peace of mind in every connection!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides reliable protection and performance, making it suitable for various industrial applications.

Propagation Delay At Nominal Supply: 7 ns

A low propagation delay ensures fast signal transmission, enhancing the overall speed and efficiency of circuit operations.

Surface Mount: YES

Surface mount technology allows for compact circuit designs and automated assembly processes, increasing manufacturing efficiency.

No. of Functions: 2

Multiple functions in a single package reduce the number of components needed, optimizing space and simplifying circuit design.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier PCB layout and provides a standardized footprint for compatibility with various designs.

No. of Bits: 4

A 4-bit configuration offers flexibility for data transmission and enhances system performance in digital applications.

Nominal Supply Voltage / Vsup: 5 V

Operating at a nominal voltage of 5V aligns with standard logic levels, ensuring compatibility with a wide range of devices.

Load Capacitance (CL): 50 pF

A lower load capacitance results in faster switching speeds, making this device an excellent choice for high-speed applications.

Power Supplies (V): 5

Single-supply operation streamlines the power management in electronic systems, simplifying design and reducing costs.

No. of Terminals: 20

Twenty terminals provide ample connectivity options for complex circuit designs, catering to a variety of application needs.

Package Style (Meter): SMALL OUTLINE

The small outline style ensures a compact footprint, which is essential for space-constrained applications.

Maximum I (ol): 64 Amp

The high output current capability allows for driving significant loads, making it suitable for demanding applications.

Propagation Delay (tpd): 7 ns

Uniform propagation delay ensures predictable timing in digital circuits, optimizing overall system performance.

Maximum Operating Temperature: 85 °C

Withstanding high temperatures, this product is ideal for industrial environments where temperature fluctuations are common.

Output Characteristics: 3-STATE

3-state output capability enhances circuit design flexibility, allowing multiple devices to share the same data bus.

Minimum Operating Temperature: -40 °C

Low-temperature operation makes this product suitable for harsh environments, ensuring reliable functionality in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finishing ensures excellent conductivity and resistance to corrosion, enhancing long-term reliability.

Terminal Position: DUAL

Dual terminal positioning offers design flexibility by enabling efficient PCB layout and thermal management.

No. of Ports: 2

Having two ports allows for versatile connection options, suitable for various applications requiring multiple signal pathways.

Maximum Seated Height: 2.65 mm

The low seated height is beneficial for space-saving applications, contributing to more compact and efficient designs.

Width: 7.5 mm

The modest width aids in compact PCB designs while still maintaining ample spacing for efficient heat dissipation.

Output Polarity: TRUE

True output polarity simplifies integration with other components and ensures compatibility with standard logic levels.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V allows for compatibility with a wide range of power supply designs.

Maximum Time At Peak Reflow Temperature: 30 s

The specified reflow time supports compatibility with modern soldering techniques, ensuring reliable assembly in production.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature compatibility makes it suitable for lead-free soldering processes, meeting environmental standards.

Length: 12.8 mm

The compact length enhances layout options for PCB designs, ensuring efficient space usage on circuit boards.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures, this product is tailored for demanding environments, ensuring durability and reliability.

Technology: TTL

TTL technology ensures fast switching and compatibility with a wide array of digital circuits, enhancing overall system performance.

Terminal Form: GULL WING

Gull-wing terminals facilitate easy soldering and improve manufacturing efficiency, supporting automated assembly processes.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for compact layout designs while maintaining compatibility with standard assembly processes.

Control Type: ENABLE LOW

Low enable control provides efficient power management by allowing devices to enter low-power states when not in use.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage supports a wide range of operational scenarios, making it versatile for various applications.

Maximum Power Supply Current (ICC): 90 mA

A maximum current rating of 90 mA allows for significant power distribution to loads, ideal for demanding applications.

Technical Specifications

Bus Driver & Transceivers I74F244D attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Family:

F/FAST

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

90 mA

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

I74F244D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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