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I74F655AN

NXP Semiconductors

I74F655AN by NXP Semiconductors

I74F655AN by NXP Semiconductors is an 8-bit bus driver with a 5.5 ns propagation delay, operating b/w -40 °C to 85 °C. It features a dual terminal design and supports 3-state output for efficient data transmission. Ideal for industrial applications requiring reliable TTL technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,398 parts In-Stock

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Vyrian

USA . 1,420 parts In-Stock

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1,420

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Anansix

USA . 559 parts In-Stock

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559

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Andel Nordic

Denmark . 460 parts In-Stock

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$7.607

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$7.303

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460

$7.607

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$7.303

One Stop Electronics

USA . 1,527 parts In-Stock

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$56.000

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$56.000

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UNI Independent Distributors

Spain . 5,699 parts In-Stock

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5,699

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Corphita

USA . 556 parts In-Stock

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Overview

Elevate your designs with the I74F655AN from NXP Semiconductors, a leader in high-quality electronics. This versatile 8-bit bus driver excels in industrial applications, offering reliable performance and robust temperature resilience. With low propagation delays and superior output characteristics, it ensures seamless data transfer. Trust NXP for innovative solutions that drive efficiency and value in your projects—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures that the product is resistant to environmental factors, leading to a longer lifespan.

Package Shape: RECTANGULAR

The rectangular package shape assists in efficient board layout and space utilization in circuit designs.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data transmission applications, making it versatile for various digital systems.

Nominal Supply Voltage / Vsup: 5V

The 5V nominal supply voltage is compatible with most standard electronic systems, simplifying integration.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for stable operation at high speeds, enhancing performance in data transmission.

No. of Terminals: 24

Having 24 terminals enables multiple connections, facilitating complex circuit designs and improved functionality.

Package Style (Meter): IN-LINE

The in-line package style provides convenient mounting options, making it easier to fit into various circuit layouts.

Propagation Delay (tpd): 5.5 ns

A low propagation delay of 5.5 ns ensures fast signal propagation, contributing to high-speed data processing.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for applications in moderately high-temperature environments.

Output Characteristics: 3-STATE

The 3-state output characteristics enable multiple devices to share the same bus system, improving flexibility in design.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for industrial applications in extreme conditions.

Terminal Position: DUAL

The dual terminal design enhances the connection stability and supports efficient circuit integration.

No. of Ports: 2

Having 2 ports allows for dual data paths, increasing the product's adaptability for multi-channel communication.

Maximum Seated Height: 4.7 mm

A compact seated height of 4.7 mm facilitates integration into space-constrained designs without compromising performance.

Width: 7.62 mm

The width of 7.62 mm is standard, making it easy to fit into various circuit board designs.

Output Polarity: INVERTED

The inverted output polarity can be advantageous in certain logical configurations, offering flexibility in circuit design.

Minimum Supply Voltage (Vsup): 4.5 V

The ability to operate down to 4.5 V enhances compatibility with battery-operated and low-voltage systems.

Length: 31.7 mm

A length of 31.7 mm provides a balanced form factor that is conducive to efficient PCB layout.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates reliability and robustness for demanding applications.

Technology: TTL

Using TTL (Transistor-Transistor Logic) technology offers low power consumption and high-speed processing capabilities.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures strong mechanical connections, making it ideal for prototyping and rugged applications.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard, allowing for compatibility with a wide range of PCB designs and components.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V provides a safe operating margin, ensuring reliability and stability under varying conditions.

Maximum Power Supply Current (ICC): 110 mA

With a maximum power supply current of 110 mA, this product can drive substantial loads, making it suitable for demanding applications.

Technical Specifications

Bus Driver & Transceivers I74F655AN attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH TRIPLE OUTPUT ENABLE; ODD/EVEN PARITY GENERATION WITH TRISTATE OUTPUTS

Family:

F/FAST

JESD-30 Code:

R-PDIP-T24

Length:

31.7 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

110 mA

Propagation Delay (tpd):

5.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

I74F655AN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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