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HEF4030BP,652

NXP Semiconductors

HEF4030BP,652 by NXP Semiconductors

HEF4030BP,652 by NXP Semiconductors is a CMOS Logic Gates IC with 4 functions and 2 inputs. It operates at a supply voltage range of 3-15V, offering a propagation delay of 175ns. Widely used in industrial applications due to its high temperature tolerance up to 85°C.

Median Price

$0.357

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$0.357

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700

$0.357

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Digiode

USA . 4,500 parts In-Stock

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4,500

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Vyrian

USA . 4,334 parts In-Stock

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4,334

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Anansix

USA . 1,253 parts In-Stock

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1,253

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,564 parts In-Stock

1+ parts

$0.357

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$0.350

3,564

$0.357

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$0.350

Netroflash

USA . 1,000 parts In-Stock

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$0.357

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1,000

$0.357

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Argo Parts USA

USA . 545 parts In-Stock

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$0.357

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$0.347

545

$0.357

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$0.347

Microchip USA

USA . 209 parts In-Stock

1+ parts

$7.550

100+ parts

$7.550

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$7.550

10k+ parts

$7.550

209

$7.550

$7.550

$7.550

$7.550

AZTECH Wire

Italy . 692 parts In-Stock

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$12.946

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692

$12.946

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Ampacity Inc.

Singapore . 685 parts In-Stock

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$13.000

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685

$13.000

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One Stop Electronics

USA . 1,425 parts In-Stock

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$14.000

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$14.000

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Corohmni

South Africa . 142 parts In-Stock

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$17.237

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142

$17.237

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Perfect Parts

USA . 11,654 parts In-Stock

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UNI Independent Distributors

Spain . 6,180 parts In-Stock

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Corphita

USA . 2,338 parts In-Stock

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Overview

Discover the unmatched quality and reliability of the HEF4030BP,652 by NXP Semiconductors, a leading manufacturer in the industry. This logic gate offers seamless performance and precision with its 4 functions and 2 inputs, making it ideal for a wide range of applications. Whether you're designing circuits for industrial automation or consumer electronics, this product delivers exceptional value with its fast propagation delay and wide operating temperature range. Trust NXP Semiconductors to provide innovative solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 175 ns

The low propagation delay ensures fast signal processing and response times.

No. of Functions: 4

Having multiple functions in one package increases efficiency and saves space on a circuit board.

No. of Inputs: 2

Having multiple inputs allows for more complex logic operations to be performed.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common voltage of 5V makes integration with other components easier.

Technical Specifications

Logic Gates HEF4030BP,652 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.36 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/15

Propagation Delay At Nominal Supply:

175 ns

Propagation Delay (tpd):

175 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HEF4030BP,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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