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GTL2014PW,112

NXP Semiconductors

GTL2014PW,112 by NXP Semiconductors

GTL2014PW,112 by NXP Semiconductors is a 14-terminal interface IC with a supply voltage range of 3V to 3.6V. It features a small outline package style and operates in industrial temperature grades (-40°C to 85°C). Ideal for applications requiring reliable signal interfacing in compact electronic devices.

Median Price

$0.515

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$0.515

1k+ parts

$0.428

10k+ parts

$0.381

10

-

$0.515

$0.428

$0.381

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,797 parts In-Stock

1+ parts

$0.401

100+ parts

-

1k+ parts

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10k+ parts

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3,797

$0.401

-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.000

100+ parts

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100

$1.000

-

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Vyrian

USA . 2,882 parts In-Stock

1+ parts

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2,882

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Anansix

USA . 2,740 parts In-Stock

1+ parts

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2,740

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Flip Electronics

USA . 1,760 parts In-Stock

1+ parts

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1,760

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,219 parts In-Stock

1+ parts

$0.380

100+ parts

-

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10k+ parts

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4,219

$0.380

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.000

100+ parts

$0.980

1k+ parts

-

10k+ parts

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1,000

$1.000

$0.980

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Advanced Electronics

New Zealand . 45 parts In-Stock

1+ parts

$7.110

100+ parts

$6.470

1k+ parts

$5.830

10k+ parts

-

45

$7.110

$6.470

$5.830

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AZTECH Wire

Italy . 889 parts In-Stock

1+ parts

$16.431

100+ parts

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889

$16.431

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QUARKTWIN TECHNOLOGY LTD

USA . 29,027 parts In-Stock

1+ parts

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29,027

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UNI Independent Distributors

Spain . 7,320 parts In-Stock

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7,320

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Microchip USA

USA . 3,642 parts In-Stock

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3,642

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Perfect Parts

USA . 2,796 parts In-Stock

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2,796

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iodParts Technologies Inc.

India . 350 parts In-Stock

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350

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Overview

Elevate your electronic projects with the GTL2014PW,112 by NXP Semiconductors. Designed with precision and quality in mind, this interface IC offers seamless connectivity and reliable performance. Whether you're working on industrial automation or consumer electronics, this versatile component will provide the speed and efficiency you need. Say goodbye to compatibility issues and hello to smooth operation with the GTL2014PW,112. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages for versatility in different applications.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and facilitates easier integration into circuit designs.

Power Supplies (V): 3.3

Stable 3.3V power supply ensures consistent performance.

No. of Terminals: 14

Sufficient number of terminals for connecting to other components in a circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the circuit board and allows for higher component density.

Minimum Supply Voltage: 3 V

Low minimum supply voltage requirement makes it suitable for low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability in various environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for use in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish for good conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit board layout.

Maximum Seated Height: 1.1 mm

Low profile design for space-constrained applications.

Width: 4.4 mm

Compact width dimension for efficient use of board space.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time for quick and reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for robust soldering process.

Length: 5 mm

Small length dimension for space-saving installations.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable performance in harsh conditions.

Terminal Form: GULL WING

Gull wing terminal form for easy surface mounting and soldering.

Nominal Supply Voltage: 3.3 V

Stable 3.3V nominal supply voltage for consistent operation.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density packaging and miniaturization.

Interface IC Type: INTERFACE CIRCUIT

Specialized interface IC type for seamless communication between different components.

Technical Specifications

Other Function Interface ICs GTL2014PW,112 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

GTL2014PW,112 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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