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CBTL06121BHF,518

NXP Semiconductors

CBTL06121BHF,518 by NXP Semiconductors

CBTL06121BHF,518 from NXP Semiconductors is a differential multiplexer featuring 6 functions and operates at a nominal voltage of 3.3 V. It supports industrial applications with a temp range of -40 °C to 85 °C and has 56 terminals in a no-lead package. Ideal for compact designs, it ensures low power consumption at just 1 mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,695 parts In-Stock

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5,695

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Anansix

USA . 1,285 parts In-Stock

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1,285

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Digiode

USA . 691 parts In-Stock

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691

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Distributors (Availability)

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Native Components

USA . 62 parts In-Stock

1+ parts

$1.623

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62

$1.623

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Northwest PG Solutions

USA . 1,322 parts In-Stock

1+ parts

$1.785

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1,322

$1.785

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One Stop Electronics

USA . 1,610 parts In-Stock

1+ parts

$2.500

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1,610

$2.500

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AZTECH Wire

Italy . 650 parts In-Stock

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$13.220

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650

$13.220

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QUARKTWIN TECHNOLOGY LTD

USA . 13,575 parts In-Stock

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13,575

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Microchip USA

USA . 5,306 parts In-Stock

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5,306

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UNI Independent Distributors

Spain . 2,776 parts In-Stock

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2,776

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Corphita

USA . 1,771 parts In-Stock

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1,771

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Overview

Elevate your projects with the CBTL06121BHF,518 from NXP Semiconductors, a trusted leader in innovative solutions. This advanced differential multiplexer excels in reliability and performance, ensuring seamless signal management across diverse applications. With its robust design and wide temperature range, it meets industrial demands while saving space and energy. Experience superior quality and efficiency that empowers your designs to achieve new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy materials enhances the product's reliability and ensures resistance to harsh environmental conditions.

Surface Mount: YES

Surface mount capability allows for efficient space utilization on printed circuit boards, making it ideal for compact designs.

No. of Functions: 6

With six functions, this multiplexer can handle multiple signal routing tasks, increasing flexibility in circuit design.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier integration into various electronic circuits, providing versatility in application.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal supply voltage of 3.3 V ensures compatibility with many modern digital circuits and low-power applications.

Power Supplies (V): 3.3

A single supply voltage simplifies the design and reduces the complexity of power management in electronic systems.

No. of Terminals: 56

With 56 terminals, this component provides ample connectivity options, supporting complex circuit designs.

Package Style (Meter): CHIP CARRIER

The chip carrier style is beneficial for enhancing thermal performance and ease of handling during assembly.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures the multiplexer can function effectively in high-temperature environments.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes this product suitable for industrial applications in extreme conditions.

Terminal Position: QUAD

Quad terminal positioning allows for a compact layout, promoting efficient PCB design and minimizing signal loss.

Other IC type: DIFFERENTIAL MULTIPLEXER

Being a differential multiplexer, it offers improved noise immunity and signal integrity, making it ideal for high-speed applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures the component can withstand demanding environments, enhancing long-term reliability.

Maximum Supply Current (Isup): 1 mA

A low maximum supply current of 1 mA signifies low power consumption, making it an energy-efficient choice for battery-operated devices.

No. of Channels: 2

Having two channels means this multiplexer can switch between two signals effectively, making it versatile for various applications.

Terminal Form: NO LEAD

The no-lead terminal form minimizes space requirements and reduces the potential for solder joint fatigue, enhancing overall reliability.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density circuit designs, which is crucial in modern miniaturized electronics.

Technical Specifications

Multiplexers & Switches CBTL06121BHF,518 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N56

No. of Channels:

2

No. of Functions:

6

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.19X.43,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

1 mA

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

CBTL06121BHF,518 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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