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CBTL06121AHF,518

NXP Semiconductors

CBTL06121AHF,518 by NXP Semiconductors

CBTL06121AHF,518 from NXP Semiconductors is a differential multiplexer with 6 functions and operates at a nominal voltage of 3.3 V. It features a compact chip carrier package with no lead terminals and supports industrial temperature ranges from -40 °C to 85 °C. Ideal for space-constrained applications, it ensures efficient signal routing in electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,438 parts In-Stock

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3,438

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Digiode

USA . 3,352 parts In-Stock

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Anansix

USA . 505 parts In-Stock

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505

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Native Components

USA . 194 parts In-Stock

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$0.264

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$0.254

194

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Northwest PG Solutions

USA . 2,372 parts In-Stock

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$0.291

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$0.256

2,372

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$0.256

Ampacity Inc.

Singapore . 886 parts In-Stock

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$3.500

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886

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One Stop Electronics

USA . 1,349 parts In-Stock

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$5.500

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Microchip USA

USA . 128 parts In-Stock

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$9.684

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128

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AZTECH Wire

Italy . 245 parts In-Stock

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$9.700

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QUARKTWIN TECHNOLOGY LTD

USA . 23,184 parts In-Stock

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UNI Independent Distributors

Spain . 5,760 parts In-Stock

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Corphita

USA . 2,683 parts In-Stock

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Overview

Elevate your designs with the CBTL06121AHF,518 from NXP Semiconductors, a trusted leader in innovative solutions. This high-performance differential multiplexer offers exceptional reliability in demanding industrial applications, ensuring seamless data management with minimal power consumption. With its robust construction and advanced features, you gain unmatched flexibility and efficiency, empowering your projects to meet rigorous standards while enhancing overall performance. Experience the difference with NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for efficient use of space on printed circuit boards, making it ideal for compact designs.

No. of Functions: 6

With 6 functions, this multiplexer provides versatility in handling multiple signal paths, enhancing system capabilities.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into various circuit designs, optimizing space utilization.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal supply voltage of 3.3 V makes this device compatible with low-power systems, improving energy efficiency.

Power Supplies (V): 3.3

A uniform power supply requirement of 3.3 V simplifies design considerations and enhances reliability in applications.

No. of Terminals: 56

With 56 terminals, this component allows for multiple connection options, providing flexibility for various circuit configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style helps in effective thermal management and reliable electrical performance.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85 °C ensures the device can perform reliably in higher temperature environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this multiplexer is suitable for industrial applications in harsh conditions.

Terminal Position: QUAD

The quad terminal position offers efficient signal routing and enhances interconnection options within the circuit.

Other IC type: DIFFERENTIAL MULTIPLEXER

Being a differential multiplexer, it ensures superior noise immunity and signal integrity, making it reliable for critical applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates robustness and reliability, making this product suitable for demanding environments.

Maximum Supply Current (Isup): 1 mA

A low maximum supply current of 1 mA contributes to lower power consumption, ideal for energy-sensitive applications.

No. of Channels: 2

With 2 channels, this multiplexer provides basic yet effective functionality for signal selection in simpler applications.

Terminal Form: NO LEAD

The no-lead terminal form enhances the surface mounting process, allowing for a compact footprint and improving layout flexibility.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm promotes a compact design, making it ideal for high-density applications where space is limited.

Technical Specifications

Multiplexers & Switches CBTL06121AHF,518 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N56

No. of Channels:

2

No. of Functions:

6

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.19X.43,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

1 mA

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

CBTL06121AHF,518 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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