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CBTL06141EE/G,118

NXP Semiconductors

CBTL06141EE/G,118 by NXP Semiconductors

CBTL06141EE/G,118 by NXP Semiconductors is a versatile multiplexer with 4 channels and operates at a nominal voltage of 3.3 V. It features a fine pitch grid array package and supports temperatures from -10 °C to 85 °C. Ideal for compact electronic applications requiring efficient signal routing.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,441 parts In-Stock

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Prism Electronics

USA . 3,436 parts In-Stock

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Anansix

USA . 1,634 parts In-Stock

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Digiode

USA . 355 parts In-Stock

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355

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Connector Distribution Corp

USA . 7 parts In-Stock

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Right Parts Inc.

USA . 7 parts In-Stock

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One Stop Electronics

USA . 442 parts In-Stock

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$5.500

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442

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AZTECH Wire

Italy . 661 parts In-Stock

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$17.080

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QUARKTWIN TECHNOLOGY LTD

USA . 9,552 parts In-Stock

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Microchip USA

USA . 4,029 parts In-Stock

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Perfect Parts

USA . 3,848 parts In-Stock

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Corphita

USA . 1,965 parts In-Stock

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Northwest PG Solutions

USA . 882 parts In-Stock

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Native Components

USA . 257 parts In-Stock

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UNI Independent Distributors

Spain . 178 parts In-Stock

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Overview

Elevate your designs with the CBTL06141EE/G,118 from NXP Semiconductors—a trusted leader in cutting-edge technology. This high-quality multiplexer offers unmatched reliability and versatility for your applications, ensuring seamless performance across various environments. With a compact design and efficient power management, it simplifies complex tasks, enhances signal integrity, and delivers exceptional value, making it the ideal choice for innovative projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, making this multiplexer/switch suitable for space-constrained applications.

No. of Functions: 3

With three functions available, this product offers versatility, allowing it to perform multiple roles in a circuit.

Package Shape: SQUARE

The square package shape facilitates efficient use of PCB space, improving layout options for designers.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal supply voltage of 3.3 V makes it compatible with most modern digital circuits, enhancing its usability.

Power Supplies (V): 3.3

Support for a 3.3 V power supply ensures compatibility with low-power applications, promoting energy efficiency.

No. of Terminals: 48

Having 48 terminals provides multiple connection points, allowing for flexible circuit design and higher integration.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array style aids in high-density mounting, essential for modern compact electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures that the product can function reliably in a variety of environments and conditions.

Minimum Operating Temperature: -10 °C

With a minimum operating temperature of -10 °C, the device is suitable for applications in colder climates without risk of failure.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB layout and assembly, reducing the complexity of circuit board design.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures that the device can withstand soldering processes, maintaining integrity throughout assembly.

Maximum Supply Current (Isup): 1 mA

A low maximum supply current of 1 mA makes this product power-efficient, which is critical for battery-operated devices.

No. of Channels: 4

Having four channels enables multiple signal pathways, enhancing capability and flexibility in data routing.

Terminal Form: BALL

The ball terminal form improves soldering performance, leading to reliable electrical connections on the PCB.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for tighter packing of components, which is essential for high-density applications.

Technical Specifications

Multiplexers & Switches CBTL06141EE/G,118 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B48

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

1 mA

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

CBTL06141EE/G,118 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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