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CBTL06122BHF-T

NXP Semiconductors

CBTL06122BHF-T by NXP Semiconductors

CBTL06122BHF-T from NXP Semiconductors is a 6-function differential multiplexer designed for industrial applications. It operates at a nominal voltage of 3.3 V and supports temperatures from -40 °C to 85 °C. With a compact chip carrier package, it features 56 terminals and low power consumption (1 mA).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,864 parts In-Stock

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4,864

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Anansix

USA . 2,518 parts In-Stock

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2,518

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Vyrian

USA . 34 parts In-Stock

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34

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Native Components

USA . 168 parts In-Stock

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$0.126

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$0.121

168

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Northwest PG Solutions

USA . 1,158 parts In-Stock

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$0.139

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1,158

$0.139

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$0.122

One Stop Electronics

USA . 1,620 parts In-Stock

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$1.500

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1,620

$1.500

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Corphita

USA . 2,898 parts In-Stock

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UNI Independent Distributors

Spain . 1,725 parts In-Stock

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1,725

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Overview

Elevate your designs with the CBTL06122BHF-T from NXP Semiconductors, a trusted leader in high-quality electronic solutions. This advanced differential multiplexer offers unparalleled versatility and reliability for industrial applications, ensuring optimal performance across diverse environments. With its compact design and efficient power management, this component enhances system efficiency and durability, making it an essential choice for engineers seeking superior reliability and innovative functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient utilization of PCB space, making this product ideal for modern electronics.

No. of Functions: 6

With six functions, this multiplexer provides versatility, allowing users to perform various tasks or switch between multiple signals efficiently.

Package Shape: RECTANGULAR

The rectangular package shape aids in convenient mounting and compatibility with standard PCB layouts.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal supply voltage of 3.3V makes it compatible with many low-power digital systems, enhancing its usability.

Power Supplies (V): 3.3

Requirement for 3.3V power supply contributes to low power consumption, which is essential for battery-operated devices.

No. of Terminals: 56

With 56 terminals, this device allows for extensive connectivity options, enabling complex circuit designs.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers easy handling and efficient thermal management, critical in high-performance applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability under various conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is robust enough for extreme environmental conditions.

Terminal Position: QUAD

The quad terminal position provides an organized layout that simplifies connections and enhances signal integrity.

Other IC type: DIFFERENTIAL MULTIPLEXER

As a differential multiplexer, it offers improved noise immunity and better signal integrity, making it ideal for sensitive applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures consistent performance even in harsh environments, extending the product's lifespan.

Maximum Supply Current (Isup): 1 mA

With a maximum supply current of only 1 mA, this device is energy-efficient, minimizing power consumption in applications.

No. of Channels: 2

Having two channels allows simultaneous handling of dual signals, thus increasing operational efficiency.

Terminal Form: NO LEAD

The no-lead terminal form enables better packaging density, ideal for high-density PCB designs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for compact arrangements on PCBs, facilitating advanced circuit designs while conserving space.

Technical Specifications

Multiplexers & Switches CBTL06122BHF-T attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N56

No. of Channels:

2

No. of Functions:

6

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.19X.43,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

1 mA

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

CBTL06122BHF-T Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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