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CBTL05024BS

NXP Semiconductors

CBTL05024BS by NXP Semiconductors

CBTL05024BS from NXP Semiconductors is a differential multiplexer with a 3.3V nominal voltage, featuring 24 terminals in a very thin profile package. It operates b/w -20 °C to 85 °C and offers a max on-state resistance of 12Ω. Ideal for compact electronic applications requiring efficient signal routing.

Median Price

$6.951

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 951 parts In-Stock

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$6.951

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$7.298

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$6.881

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J2 Sourcing AB

Sweden . 42,000 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

USA . 4,133 parts In-Stock

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Digiode

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Anansix

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Vyrian

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Distributors (Availability)

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One Stop Electronics

USA . 880 parts In-Stock

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$0.500

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Northwest PG Solutions

USA . 2,209 parts In-Stock

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$2.721

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Kepictronics

USA . 6,000 parts In-Stock

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Corphita

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UNI Independent Distributors

Spain . 4,316 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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Alle Elektronik GmbH

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Native Components

USA . 295 parts In-Stock

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Overview

Elevate your designs with the CBTL05024BS from NXP Semiconductors, a trusted leader in innovation. This high-quality differential multiplexer is engineered for efficiency and reliability, perfect for applications in telecommunications, consumer electronics, and automotive systems. With its compact, heat-resistant package and low on-state resistance, it delivers optimal performance while saving space. Experience unparalleled value and enhance your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliable performance and protection from environmental factors, making it ideal for various applications.

Surface Mount: YES

The surface mount design allows for compact integration on PCBs, which is essential for modern electronic devices.

Package Shape: SQUARE

The square shape facilitates efficient use of space on the circuit board, optimizing layout and functionality.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a standard supply voltage enhances compatibility with existing systems and reduces power consumption.

No. of Terminals: 24

A higher number of terminals allows for greater connectivity options, making it versatile in complex applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile ensures space-saving benefits while the heat sink/slug design helps manage thermal performance.

Maximum Operating Temperature: 85 °C

This high operating temperature rating enables usage in demanding environments without the risk of failure.

Minimum Operating Temperature: -20 °C

The ability to function in low temperatures expands its usability in a wider range of environmental conditions.

Terminal Position: QUAD

Quad terminal positioning enhances connectivity and improves layout options for more efficient circuit design.

Maximum Seated Height: 1 mm

A low seated height contributes to a slim profile, allowing for reduced PCB height and better overall design.

Width: 3 mm

Compact dimensions make this product suitable for space-constrained applications, improving design flexibility.

Other IC type: DIFFERENTIAL MULTIPLEXER

Differential multiplexing allows for improved signal integrity and reduced noise, making it ideal for sensitive applications.

Minimum Supply Voltage (Vsup): 3 V

Operating effectively at lower supply voltage increases energy efficiency and allows better battery performance in portable applications.

Maximum On-state Resistance (Ron): 12 ohm

A low on-state resistance means reduced power loss and improved efficiency in signal transmission.

Maximum Supply Current (Isup): 0.35 mA

Low supply current reduces overall power consumption, making this product energy-efficient and ideal for battery-powered devices.

Terminal Form: NO LEAD

A no lead configuration facilitates easier soldering and assembly while reducing the overall footprint of the component.

Maximum Supply Voltage (Vsup): 3.6 V

This maximum supply voltage provides flexibility while ensuring safety margins during operation.

Nominal Off-state Isolation: 20 dB

Good off-state isolation minimizes crosstalk and interference, improving the reliability of electronic circuits.

Minimum Input Voltage: -0.3 V

The ability to handle negative voltages increases device versatility and protects against transient conditions.

Maximum Input Voltage: 5.5 V

The wide input voltage range allows for greater adaptability in different circuit designs and enhances compatibility with various components.

Technical Specifications

Multiplexers & Switches CBTL05024BS attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

-.3 V

JESD-30 Code:

S-PQCC-N24

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Nominal Off-state Isolation:

20 dB

Maximum On-state Resistance (Ron):

12 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.12SQ(UNSPEC)

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

.35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Width (mm):

3 mm

Trade Compliance

CBTL05024BS Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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