Loading...

BUK9E6R1-100E,127

NXP Semiconductors

BUK9E6R1-100E,127 by NXP Semiconductors

BUK9E6R1-100E,127 from NXP Semiconductors is an N-channel power FET designed for efficient switching applications. It features a max drain current of 120 A, a breakdown voltage of 100 V, and operates at up to 175 °C. Ideal for high-power circuits, it ensures reliable performance with low on-resistance.

Median Price

$2.280

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 285 parts In-Stock

1+ parts

-

100+ parts

$2.280

1k+ parts

$2.040

10k+ parts

$1.920

285

-

$2.280

$2.040

$1.920

DigiKey

USA . 285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.350

10k+ parts

$1.350

285

-

-

$1.350

$1.350

Verical

USA . 285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.550

10k+ parts

$2.400

285

-

-

$2.550

$2.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,417 parts In-Stock

1+ parts

$1.235

100+ parts

-

1k+ parts

-

10k+ parts

-

3,417

$1.235

-

-

-

Vyrian

USA . 4,713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,713

-

-

-

-

Anansix

USA . 1,977 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,977

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 5 parts In-Stock

1+ parts

$0.283

100+ parts

-

1k+ parts

-

10k+ parts

$0.272

5

$0.283

-

-

$0.272

Northwest PG Solutions

USA . 1,144 parts In-Stock

1+ parts

$0.312

100+ parts

-

1k+ parts

-

10k+ parts

$0.275

1,144

$0.312

-

-

$0.275

Corphita

USA . 4,160 parts In-Stock

1+ parts

$1.170

100+ parts

-

1k+ parts

-

10k+ parts

-

4,160

$1.170

-

-

-

Microchip USA

USA . 10,460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,460

-

-

-

-

UNI Independent Distributors

Spain . 2,853 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,853

-

-

-

-

Continental Prestige Electronics

USA . 285 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

-

10k+ parts

-

285

-

$1.560

-

-

Overview

Unlock unparalleled efficiency with the BUK9E6R1-100E,127 from NXP Semiconductors, a leader in power management solutions. This N-channel FET excels in demanding applications, offering exceptional reliability and performance for switching tasks. Designed with built-in diode functionality and robust thermal characteristics, it ensures optimal operation even in extreme conditions. Experience innovation that empowers your designs while delivering superior value and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making the FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally offer better efficiency and performance in switching applications, ensuring low on-state resistance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies design and improves space efficiency, preventing reverse current when turn-off occurs.

Transistor Application: SWITCHING

Designed for high-speed switching, this FET is ideal for applications such as power supplies, motor control, and amplifiers.

Minimum DS Breakdown Voltage: 100 V

A breakdown voltage of 100 V allows the FET to be used in high voltage applications without risk of failure.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout and component placement on PCBs, allowing for compact design.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and are easy to solder, suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require gate voltage for conduction, offering high input impedance and low power consumption.

Maximum Pulsed Drain Current (IDM): 576 A

A high pulsed drain current rating allows this FET to handle demanding applications that require rapid current surge capabilities.

Avalanche Energy Rating (EAS): 387 mJ

A high avalanche energy rating indicates the FET's ability to withstand transient voltage spikes, enhancing reliability.

Maximum Drain Current (Abs) (ID): 120 A

With a maximum drain current of 120 A, this FET can handle significant load currents, making it suitable for high power applications.

No. of Terminals: 3

The 3-terminal design simplifies circuit connections and reduces assembly complexity.

Maximum Power Dissipation (Abs): 349 W

A high power dissipation capability ensures that this FET can effectively manage heat in demanding applications, enhancing longevity.

Package Style (Meter): IN-LINE

The in-line package style allows for efficient use of space on PCBs, facilitating easier integration into designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enables high switching speeds and efficiency, making this product suitable for a wide range of applications.

Maximum Operating Temperature: 175 °C

The high operating temperature rating expands the range of environments and applications where this FET can be reliably used.

Transistor Element Material: SILICON

Silicon as the transistor material provides good performance characteristics, including thermal stability and reliability.

Terminal Finish: Tin (Sn)

The tin terminal finish ensures good conductivity and solderability, contributing to the overall ease of assembly.

Maximum Drain Current (ID): 120 A

This repeated specification reaffirms the FET's robust capability to manage substantial loads.

Maximum Drain-Source On Resistance: 0.0061 ohm

A low on-resistance minimizes power losses and heat generation during operation, significantly improving efficiency.

Terminal Position: SINGLE

A single terminal position simplifies connections, making it easier for circuit design and integration.

Case Connection: DRAIN

Having case connection at the drain contributes to effective thermal management, as the drain typically carries high currents.

Reference Standard: AEC-Q101; IEC-60134

Meeting these standards ensures the FET is suitable for automotive and critical applications, indicating a high level of reliability.

Technical Specifications

Power Field Effect Transistors (FET) BUK9E6R1-100E,127 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

387 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0061 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

576 A

Reference Standard:

AEC-Q101; IEC-60134

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BUK9E6R1-100E,127 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20