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BUK6507-75C,127

NXP Semiconductors

BUK6507-75C,127 by NXP Semiconductors

The BUK6507-75 °C,127 by NXP Semiconductors is a powerful N-channel FET designed for high-performance applications. It supports a max drain current of 100 A and power dissipation of 204 W, operating efficiently up to 175 °C. Ideal for switching and amplification in various electronic circuits.

Median Price

$1.230

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 526 parts In-Stock

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-

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$1.210

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$1.000

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$0.895

526

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$0.895

Verical

USA . 326 parts In-Stock

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$1.250

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$1.119

326

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$1.119

Distributors (In-Stock)

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Digiode

USA . 2,970 parts In-Stock

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$0.484

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$0.484

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Vyrian

USA . 4,682 parts In-Stock

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Anansix

USA . 2,017 parts In-Stock

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Corphita

USA . 245 parts In-Stock

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$0.458

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245

$0.458

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AZTECH Wire

Italy . 300 parts In-Stock

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$8.630

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300

$8.630

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QUARKTWIN TECHNOLOGY LTD

USA . 9,162 parts In-Stock

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Microchip USA

USA . 6,448 parts In-Stock

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UNI Independent Distributors

Spain . 1,707 parts In-Stock

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Northwest PG Solutions

USA . 438 parts In-Stock

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Native Components

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Overview

Unlock unparalleled performance with the BUK6507-75 °C,127 from NXP Semiconductors! This exceptional N-channel Power FET champions efficiency and reliability, making it ideal for demanding applications in industrial automation, automotive, and renewable energy sectors. Crafted with NXP's commitment to quality, this transistor ensures superior power handling and thermal stability, delivering significant value and peace of mind for your projects. Experience enhanced operational excellence today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher electron mobility, which results in better performance and efficiency compared to P-channel devices, making this product suitable for high-speed applications.

Configuration: SINGLE

A single configuration simplifies circuit design and reduces the overall footprint, making this transistor ideal for space-constrained applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for minimal power consumption when the device is off, making this FET an energy-efficient choice for many applications.

Maximum Drain Current (Abs): 100 A

With a maximum drain current of 100 A, this FET can handle high power loads, making it suitable for demanding applications such as power supplies and motor drives.

Maximum Power Dissipation (Abs): 204 W

A high power dissipation rating of 204 W means this FET can effectively handle thermal stress, enhancing reliability and performance in rigorous conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high input impedance and low drive power, which is essential for reducing energy waste and improving overall circuit efficiency.

Maximum Operating Temperature: 175 °C

Operating at temperatures up to 175 °C allows this FET to function reliably in harsh environments, extending its usability in industrial applications.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and corrosion resistance, ensuring robust electrical connections and longevity of the device.

Maximum Drain Current (ID): 100 A

Affirming the robust capability, the 100 A maximum drain current indicates this FET can be an exceptional choice for high current applications.

Technical Specifications

Power Field Effect Transistors (FET) BUK6507-75C,127 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

100 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Trade Compliance

BUK6507-75C,127 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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