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BLV37

NXP Semiconductors

BLV37 by NXP Semiconductors

BLV37 by NXP Semiconductors is an NPN RF power BJT designed for amplifier applications. It features a max power dissipation of 290W, operates at very high frequencies, and offers a min power gain of 10.5 dB. Its ceramic, metal-sealed package ensures durability in demanding environments.

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3

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1k+

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Anansix

USA . 2,300 parts In-Stock

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Digiode

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Vyrian

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One Stop Electronics

USA . 703 parts In-Stock

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$23.050

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UNI Independent Distributors

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Northwest PG Solutions

USA . 1,473 parts In-Stock

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Native Components

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Corphita

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Kepictronics

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Overview

Unlock unparalleled performance with the BLV37 from NXP Semiconductors, a powerhouse in RF Power BJTs. Crafted with precision and reliability, this transistor excels in high-frequency applications, delivering robust amplification for your projects. Its superior ceramic and metal-sealed packaging ensures durability, while NXP's industry-leading expertise guarantees long-lasting quality. Elevate your designs with the BLV37, offering unmatched efficiency and outstanding value for engineers and innovators alike!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package ensures high durability and resistance to environmental factors, making the transistor suitable for demanding applications.

Polarity or Channel Type: NPN

NPN configuration allows for easier integration into common amplifier circuits, enabling efficient signal amplification.

Configuration: COMMON EMITTER, 2 ELEMENTS

The common emitter configuration is widely used in amplifier designs, providing high gain and flexibility in applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in relevant circuits.

Surface Mount: YES

Surface mount capability facilitates compact designs and easy integration into modern electronic circuits.

Minimum Power Gain (Gp): 10.5 dB

A minimum power gain of 10.5 dB signifies effective amplification, making this transistor suitable for both low and high gain requirements.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on printed circuit boards (PCBs).

Terminal Form: FLAT

Flat terminals enhance contact reliability and ease of mounting, ensuring stable connections.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Support for very high frequency operations makes this transistor ideal for RF applications, including telecommunications.

No. of Elements: 2

Having two elements allows for greater versatility and improved performance in amplification and switching applications.

No. of Terminals: 5

Five terminals provide flexibility for various circuit configurations and improved connectivity.

Package Style (Meter): FLANGE MOUNT

Flange mount design simplifies physical placement in equipment, helping with thermal management and stability.

Maximum Power Dissipation Ambient: 290 W

A high power dissipation rating allows for robust performance under intense conditions without overheating.

Minimum DC Current Gain (hFE): 15

A minimum hFE of 15 indicates reliable gain for small signal amplification, enhancing circuit performance.

Maximum Operating Temperature: 200 °C

Operating at high temperatures (up to 200 °C) ensures performance resilience in harsh environments.

Maximum Collector-Emitter Voltage: 36 V

With a maximum collector-emitter voltage of 36 V, this transistor can handle significant voltage levels in various applications.

Transistor Element Material: SILICON

Silicon material provides excellent electrical performance and cost-effectiveness, suitable for a wide range of applications.

Maximum Collector Current (IC): 10 A

A maximum collector current of 10 A allows for higher power applications, enhancing versatility for user needs.

Terminal Position: DUAL

Dual terminal position enables better circuit layout options and optimizes electrical performance.

Case Connection: ISOLATED

Isolated case connection helps prevent unwanted electrical interactions, improving circuit reliability.

Technical Specifications

RF Power Bipolar Junction Transistors (BJT) BLV37 attributes and parameters. Explore more RF Power Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

36 V

Minimum DC Current Gain (hFE):

15

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F5

No. of Elements:

2

No. of Terminals:

5

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

290 W

Minimum Power Gain (Gp):

10.5 dB

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLV37 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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