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BLS6G2735L-30,112

NXP Semiconductors

BLS6G2735L-30,112 by NXP Semiconductors

BLS6G2735L-30,112 by NXP Semiconductors is an N-channel enhancement mode FET designed for high-performance applications. It operates at a max temp of 225 °C and withstands peak reflow temps up to 260 °C for robust reliability. Ideal for power management in electronic devices.

Median Price

$178.900

Lifecycle Status

Suppliers In-Stock

8

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1k+

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RFMW

USA . 161 parts In-Stock

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$178.900

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Flip Electronics (Authorized)

USA . 751 parts In-Stock

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DigiKey

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Nova Conductors

Japan . 10 parts In-Stock

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$0.303

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Digiode

USA . 1,373 parts In-Stock

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$169.955

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Vyrian

USA . 1,327 parts In-Stock

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Anansix

USA . 1,344 parts In-Stock

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Native Components

USA . 731 parts In-Stock

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$0.407

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$0.391

731

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Northwest PG Solutions

USA . 1,535 parts In-Stock

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$0.448

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$0.395

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Corphita

USA . 939 parts In-Stock

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$161.010

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Component Stockers USA

USA . 6 parts In-Stock

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$173.400

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Microchip USA

USA . 9,862 parts In-Stock

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UNI Independent Distributors

Spain . 336 parts In-Stock

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Overview

Unlock unmatched performance and reliability with the BLS6G2735L-30,112 from NXP Semiconductors. Crafted for excellence, this N-channel power FET promises superior efficiency and durability across diverse applications, from automotive to industrial systems. With NXP's commitment to innovation and quality, you gain a competitive edge, ensuring your designs operate seamlessly under demanding conditions. Elevate your projects with a trusted solution that drives results!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher electron mobility, resulting in faster switching speeds and better efficiency, making them ideal for high-performance applications.

Configuration: SINGLE

A single configuration allows for a compact design and simplified circuit layout, making the product suitable for smaller electronic devices.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control over the channel, allowing for a low power dissipation during off-state, thus enhancing energy efficiency.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high input impedance and low output capacitance, making the FET suitable for various applications including analog and digital signal processing.

Maximum Operating Temperature: 225 °C

The high maximum operating temperature ensures reliability and stability in extreme conditions, ideal for industrial and automotive applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature allows for consistent soldering quality during PCB assembly processes, ensuring robust connections.

Peak Reflow Temperature °C: 260

The capability to withstand peak temperatures up to 260 °C enables the FET to maintain functional integrity during soldering operations and improves compatibility with modern surface mount technology.

Technical Specifications

Power Field Effect Transistors (FET) BLS6G2735L-30,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BLS6G2735L-30,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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