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BLS6G2933P-200,117

NXP Semiconductors

BLS6G2933P-200,117 by NXP Semiconductors

BLS6G2933P-200,117 by NXP Semiconductors is an N-channel enhancement mode FET designed for high-performance applications. It supports a max drain current of 66 A and operates at temperatures up to 200 °C. Ideal for power management in various electronic devices, it features surface mount configuration.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 10,111 parts In-Stock

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Digiode

USA . 3,354 parts In-Stock

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Anansix

USA . 1,676 parts In-Stock

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Native Components

USA . 668 parts In-Stock

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$1.115

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Northwest PG Solutions

USA . 2,043 parts In-Stock

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$1.226

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$1.226

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Advanced Electronics

New Zealand . 62 parts In-Stock

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$1.938

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$1.764

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$1.589

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62

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AZTECH Wire

Italy . 759 parts In-Stock

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$13.480

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One Stop Electronics

USA . 164 parts In-Stock

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$58.050

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UNI Independent Distributors

Spain . 8,050 parts In-Stock

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Corphita

USA . 3,579 parts In-Stock

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Overview

Elevate your designs with the BLS6G2933P-200,117 from NXP Semiconductors, a leading force in semiconductor innovation. This high-performance N-channel power FET delivers exceptional efficiency and reliability, perfect for demanding applications. With its robust construction and advanced MOS technology, it ensures optimal thermal management and impressive current handling. Choose NXP for quality you can trust—unlock greater performance and value in your projects today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance and efficiency for high-speed switching applications, making this product suitable for fast operation in various electronic circuits.

Configuration: SINGLE

A single configuration simplifies design and layout, allowing for easier integration into various applications, especially in compact circuits.

Surface Mount: YES

Surface mount technology (SMT) enables compact designs and efficient use of PCB space, making this product ideal for modern electronic devices where space is at a premium.

Operating Mode: ENHANCEMENT MODE

Enhancement mode ensures that the transistor can operate efficiently in its 'off' state until a sufficient voltage is applied, reducing power consumption in inactive states.

Maximum Drain Current (Abs) (ID): 66 A

With a high maximum drain current of 66 A, this FET can handle substantial loads, making it suitable for high-power applications and efficient in driving heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high input impedance and low output capacitance, resulting in fast switching times and efficient power handling, an excellent choice for modern electronic applications.

Maximum Operating Temperature: 200 °C

A high maximum operating temperature of 200 °C allows this FET to function reliably in harsh environments and high-heat applications without compromising performance.

Maximum Drain Current (ID): 66 A

The maximum drain current specification reinforces its capability to drive significant loads, indicating robustness in demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) BLS6G2933P-200,117 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

66 A

Maximum Drain Current (ID):

66 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

BLS6G2933P-200,117 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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