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BLL1214-35

NXP Semiconductors

BLL1214-35 by NXP Semiconductors

N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): 110 W; Terminal Form: FLAT; Moisture Sensitivity Level (MSL): NOT APPLICABLE;

Median Price

$184.290

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,025 parts In-Stock

1+ parts

$184.290

100+ parts

$173.230

1k+ parts

$162.180

10k+ parts

-

5,025

$184.290

$173.230

$162.180

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 755 parts In-Stock

1+ parts

$203.784

100+ parts

-

1k+ parts

-

10k+ parts

-

755

$203.784

-

-

-

Vyrian

USA . 4,019 parts In-Stock

1+ parts

$214.510

100+ parts

-

1k+ parts

-

10k+ parts

-

4,019

$214.510

-

-

-

Anansix

USA . 2,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,650

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 11 parts In-Stock

1+ parts

$1.364

100+ parts

-

1k+ parts

-

10k+ parts

-

11

$1.364

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$2.340

100+ parts

$2.129

1k+ parts

$1.919

10k+ parts

-

5,000

$2.340

$2.129

$1.919

-

Native Components

USA . 389 parts In-Stock

1+ parts

$94.430

100+ parts

-

1k+ parts

-

10k+ parts

$90.653

389

$94.430

-

-

$90.653

Northwest PG Solutions

USA . 1,821 parts In-Stock

1+ parts

$103.873

100+ parts

-

1k+ parts

-

10k+ parts

-

1,821

$103.873

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-

-

Corphita

USA . 152 parts In-Stock

1+ parts

$193.059

100+ parts

-

1k+ parts

-

10k+ parts

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152

$193.059

-

-

-

Microchip USA

USA . 9,185 parts In-Stock

1+ parts

$308.865

100+ parts

-

1k+ parts

-

10k+ parts

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9,185

$308.865

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-

-

UNI Independent Distributors

Spain . 7,018 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,018

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-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 2,380 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,380

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-

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Glotronic Ltd.

UK . 48 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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48

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Technical Specifications

RF Power Field Effect Transistors (FET) BLL1214-35 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

75 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-CDFM-F2

Moisture Sensitivity Level (MSL):

NOT APPLICABLE

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLL1214-35 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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