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SD3932

STMicroelectronics

SD3932 by STMicroelectronics

SD3932 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 20 A, a breakdown voltage of 250 V, and operates in the ultra-high frequency band. This versatile transistor supports surface mount configurations and withstands temperatures up to 200 °C.

Median Price

$128.620

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 22 parts In-Stock

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$128.620

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22

$128.620

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Verical

USA . 22 parts In-Stock

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$128.620

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22

$128.620

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Chip1Stop

Japan . 57 parts In-Stock

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$140.000

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57

$140.000

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Distributors (In-Stock)

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Digiode

USA . 1,587 parts In-Stock

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$120.802

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1,587

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Vyrian

USA . 7,898 parts In-Stock

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7,898

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Anansix

USA . 2,288 parts In-Stock

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2,288

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ComSIT Distribution GmbH

Germany . 2 parts In-Stock

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IDEA Electronic Components Group

UK . 2,095 parts In-Stock

1+ parts

$1.457

100+ parts

-

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$1.312

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2,095

$1.457

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$1.312

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$2.123

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$1.932

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$1.741

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5,000

$2.123

$1.932

$1.741

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MKK Technologies

India . 1,908 parts In-Stock

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$2.740

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1,908

$2.740

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DigiPath Technology Company

USA . 1,908 parts In-Stock

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$2.740

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1,908

$2.740

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AZTECH Wire

Italy . 179 parts In-Stock

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$11.020

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179

$11.020

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Corphita

USA . 4,566 parts In-Stock

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$114.444

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4,566

$114.444

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Parana Technologies

USA . 1,125 parts In-Stock

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$1.742

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1,125

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$1.742

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Overview

Unlock exceptional performance with the SD3932 from STMicroelectronics, a leader in cutting-edge RF power FET technology. Designed for amplification applications, this N-channel transistor delivers unmatched efficiency and reliability. Its robust construction ensures longevity even in demanding environments, making it ideal for ultra-high frequency operations. Experience superior power handling capabilities that enhance your designs while benefiting from STMicroelectronics’ commitment to quality and innovation. Elevate your projects with the SD3932—where excellence meets value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the transistor suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally more efficient and have faster switching speeds, making them ideal for amplifier applications.

Configuration: SINGLE

A single configuration allows for a compact design while optimizing operational efficiency in circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplification tasks, this FET ensures high performance in signal modulation.

Surface Mount: YES

Surface mount technology enables smaller circuit designs and easier automated assembly processes.

Minimum DS Breakdown Voltage: 250 V

A breakdown voltage of 250V provides a robust operational threshold, protecting the device in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, facilitating compact electronic designs.

Terminal Form: FLAT

Flat terminals ensure better thermal contact and easier soldering, improving reliability and performance in assemblies.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation typically offers lower power consumption in off-state, enhancing overall efficiency.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Suitable for UHF applications, this FET is optimized for transmitting and receiving signals at higher frequencies.

Maximum Drain Current (Abs) (ID): 20 A

With a maximum drain current rating of 20A, this FET can handle substantial loads, making it versatile for different applications.

No. of Terminals: 4

Four terminals provide essential connectivity for various configurations, allowing for flexibility in circuit design.

Maximum Power Dissipation (Abs): 500 W

A high power dissipation capability of 500W ensures that this FET can handle substantial power without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for easy and secure attachment to heatsinks for effective thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to high efficiency and low power losses, making it beneficial for high-speed and low-power applications.

Maximum Operating Temperature: 200 °C

A maximum operating temperature of 200 °C allows for robust operation in high-temperature environments.

Transistor Element Material: SILICON

Silicon is a well-established material for FETs, providing excellent performance and reliability in electronic components.

Maximum Drain Current (ID): 20 A

Reiterated maximum drain current ensures reliability across specifications and applications, offering design consistency.

Terminal Position: DUAL

Dual terminal positions enhance flexibility in layout design, accommodating various circuit requirements.

Case Connection: SOURCE

Source connection configuration simplifies the integration in circuits, promoting efficient signal processing.

Technical Specifications

RF Power Field Effect Transistors (FET) SD3932 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

SD3932 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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